Patents by Inventor JENG-WEN LAI

JENG-WEN LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170131738
    Abstract: A wearable device includes a frame, a circuit board, and a metallic member. The frame has a receiving space. The circuit board is received in the receiving space. The metallic member is received in the receiving space and is positioned above the circuit board. The circuit board feeds current to the metallic member and provides grounding to the metallic member, and the metallic member is configured to receive and send wireless signals.
    Type: Application
    Filed: December 31, 2015
    Publication date: May 11, 2017
    Inventors: JENG-WEN LAI, YEN-HUI LIN