Abstract: The present invention relates to a dietary product comprising ?-polyglutamic acid (?-PGA, H form), and/or one or more of its salts (i.e., ?-polyglutamate in Na+ form, ?-polyglutamate in K+ form, ?-polyglutamate in NH4+ form, ?-polyglutamate in Mg++ form, and ?-polyglutamate in Ca++ form) for use as a nutrition supplement.

Abstract: A method and system for reducing wafer edge residue following a chemical mechanical polishing operation. A semiconductor wafer can be polished utilizing a chemical mechanical polishing apparatus. Thereafter, an acid etch operation may be performed to remove a residue, such as tungsten (W), collected on the semiconductor wafer as a result of the chemical mechanical polishing operation. A spin etch operation removes residue from the edges of the semiconductor wafer following chemical mechanical polishing of the semiconductor wafer.

Abstract: The present invention relates to a moisturizer comprising ?-polyglutamic acid (?-PGA, H form), and/or one or more of its salts (i.e., ?-polyglutamate in Na+ form, ?-polyglutamate in K+ form, ?-polyglutamate in NH4+ form, ?-polyglutamate in Mg++ form, ?-polyglutamate in Ca++ form) and/or ?-polyglutamate hydrogel, wherein said moisturizer is used in cosmetic products or personal care products.

Abstract: A mobile phone hand-free extension device includes a FM radio transmitter with an active frequency searching circuitry to utilize a vehicular FM radio receiver for reproducing the audio signals from the mobile phone. The active frequency searching circuitry in this invention automatically detects which frequency band the vehicular FM radio receiver is currently using and set the RF frequency of the FM transmitter to the detected frequency. The FM transmitter relays the audio signals from the mobile phone by transmitting the audio signals through radio wave to the vehicular FM radio receiver to be reproduced by the speaker of the receiver.

Abstract: A method and system for reducing wafer edge residue following a chemical mechanical polishing operation. A semiconductor wafer can be polished utilizing a chemical mechanical polishing apparatus. Thereafter, an acid etch operation may be performed to remove a residue, such as tungsten (W), collected on the semiconductor wafer as a result of the chemical mechanical polishing operation. A spin etch operation removes residue from the edges of the semiconductor wafer following chemical mechanical polishing of the semiconductor wafer.

Abstract: A method for forming salicides with lower sheet resistance and increased sheet resistance uniformity over a semiconductor process wafer including providing a semiconductor process wafer having exposed silicon containing areas at a process surface; depositing a metal layer including at least one of cobalt and titanium over the process surface; carrying out at least one thermal annealing process to react the metal layer and silicon to form a metal silicide over the silicon containing areas; and, wet etching unsilicided areas of the metal layer with a wet etching solution including phosphoric acid (H3PO4), nitric acid (HNO3), and a carboxylic acid to leave salicides covering silicon containing areas at the process surface.

Abstract: A grass trimmer includes a fixed cutter device secured to a housing and having one or more stationary cutter blades extended out of the housing, a movable cutter device rotatably secured to the fixed cutter device and having one or more cutter blades movable relative to the stationary cutter blade of the fixed cutter device to conduct cutting operations by an eccentric member of a rotary member. A drive shank is secured to the rotary member, and a power tool may engage with the shank, to drive the rotary member and the eccentric member relative to the movable cutter device, and to move the movable cutter device relative to the fixed cutter device in reciprocating action.

Abstract: A mobile phone hand-free extension device includes a FM radio transmitter with an active frequency searching circuitry to utilize a vehicular FM radio receiver for reproducing the audio signals from the mobile phone. The active frequency searching circuitry in this invention automatically detects which frequency band the vehicular FM radio receiver is currently using and set the RF frequency of the FM transmitter to the detected frequency. The FM transmitter relays the audio signals from the mobile phone by transmitting the audio signals through radio wave to the vehicular FM radio receiver to be reproduced by the speaker of the receiver.

Abstract: Semiconductor wafer tray positioning, such as can be used in rapid thermal processing (RTP), rapid thermal annealing (RTA), and other semiconductor fabrication processes, is disclosed. A housing, such as a quartz tube, to receive a wafer tray includes at least four positioning kits. Each positioning kit includes a primary outside edge and an inside edge. The primary outside edge at least substantially corresponds to an interior sidewall of the housing. The inside edge is opposite of the primary outside edge, and has a groove that at least substantially corresponds to a part of a frame of the wafer tray. The groove is receptive to the part of the frame of the wafer tray, to assist maintaining the wafer tray in a stable position when the tray is completely positioned in the housing.

Abstract: A method for forming salicides with lower sheet resistance and increased sheet resistance uniformity over a semiconductor process wafer including providing a semiconductor process wafer having exposed silicon containing areas at a process surface; depositing a metal layer including at least one of cobalt and titanium over the process surface; carrying out at least one thermal annealing process to react the metal layer and silicon to form a metal silicide over the silicon containing areas; and, wet etching unsilicided areas of the metal layer with a wet etching solution including phosphoric acid (H3PO4), nitric acid (HNO3), and a carboxylic acid to leave salicides covering silicon containing areas at the process surface.

Abstract: A method and system for reducing wafer edge residue following a chemical mechanical polishing operation. A semiconductor wafer can be polished utilizing a chemical mechanical polishing apparatus. Thereafter, an acid etch operation may be performed to remove a residue, such as tungsten (W), collected on the semiconductor wafer as a result of the chemical mechanical polishing operation. A spin etch operation removes residue from the edges of the semiconductor wafer following chemical mechanical polishing of the semiconductor wafer.

Abstract: Semiconductor wafer tray positioning, such as can be used in rapid thermal processing (RTP), rapid thermal annealing (RTA), and other semiconductor fabrication processes, is disclosed. A housing, such as a quartz tube, to receive a wafer tray includes at least four positioning kits. Each positioning kit includes a primary outside edge and an inside edge. The primary outside edge at least substantially corresponds to an interior sidewall of the housing. The inside edge is opposite of the primary outside edge, and has a groove that at least substantially corresponds to a part of a frame of the wafer tray. The groove is receptive to the part of the frame of the wafer tray, to assist maintaining the wafer tray in a stable position when the tray is completely positioned in the housing.

Abstract: A branch shears structure includes a fixed blade, a sleeve secured on a lower portion of the fixed blade, a bar secured in the sleeve, a first pulley mounted on the sleeve, a mobile blade pivotally mounted on a mediate portion of the fixed blade, an elongated linking plate having a lower portion pivotally mounted on an upper portion of the fixed blade, a short linking plate having a first end pivotally mounted on the mobile blade and a second end pivotally mounted on the elongated linking plate, a second pulley mounted on an upper portion of the elongated linking plate, a rope in turn passing through the first pulley and the second pulley and extending outward from the second pulley for pulling the elongated linking plate which moves the short linking plate which moves the mobile blade to pivot relative to the fixed blade, and a tension spring having a first secured to the fixed blade and a second end secured to the elongated linking plate.

Abstract: A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.

Abstract: A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.

Abstract: A spanner has a handle, a head frame connected to the handle, a drive head device, a pair of reinforced plates, and a pair of arm plates. The head frame has a pair of parallel panels, and a spacing formed between the parallel panels. Each parallel panel has a first pivot hole, a second pivot hole, and a third pivot hole. The reinforced plates and the arm plates are inserted in the spacing of the head frame. Each arm plate has a square hole and a round hole. Each reinforced plate has a round aperture and a circular aperture. The drive head device has a round head. The round head of the drive head device passes through the first pivot hole of each panel and the square hole of each arm plate. A gasket is disposed on one of the panels. A bolt passes through the gasket to be engaged with the round head of the drive head device. A first pin fastens each panel, each reinforced plate, and each arm plate pivotally. A second pin fastens each panel and each reinforced plate pivotally.

Abstract: A biological microbalance array module chip, comprising a piezoelectric crystal array, probes, and a plurality of electrodes, wherein the probes is an oligonucleotides or immune materials is disclosed. The probes can be immobilized on each electrode on the crystal surface of the piezoelectric crystal array. This biological probe is used to indicate the result of hybridization or immune reaction through detecting the change of oscillation frequency of the crystal probes attached. These piezoelectric crystal can be further arranged in an N×M array. Each piezoelectric crystal is attached with probes that specifically bind to a molecular structure of the target oligonucleotides or immune materials. The biological microbalance array module chip can fast and simultaneously detect hybridization and immune reaction results.

Abstract: A ratchet screwdriver has a handle portion, a connection rod connected to the handle portion, a joint sleeve disposed on the connection rod, a circular hole in the joint sleeve, a first volute spring disposed in the circular hole, a chuck sleeve having a hexagonal blind hole and a round hole, and a bit inserted in the hexagonal blind hole. A rotating device has a first end inserted in the circular hole and a second end inserted in the round hole. A compression spring encloses the rotating device. A first C-shaped clamp retainer encloses the joint sleeve. A second C-shaped clamp retainer encloses a first distal portion of the chuck sleeve. A third C-shaped clamp retainer encloses a second distal portion of the chuck sleeve. A second volute spring is disposed in the round hole.

Abstract: A pair of shears has a fixed blade, a fixed handle connecting the fixed blade, a driving blade, and a driving handle connecting the driving blade, a spring between two handles, a pin on the crisscross portion between two blades, and a switch button on the outer side of the fixed handle. The first threaded hole and the first positioning post are formed on the front of the fixed blade. The second threaded hole and the second positioning post are formed on the inner side of the fixed handle. A cutting device such as a saw blade and a scikle is disposed in front of the fixed blade. A through hole and a positioning hole are formed on the rear of the cutting device. The first positioning post inserts in the positioning hole. A screw passes through the through hole and the first threaded hole to fasten the cutting device.