Patents by Inventor Jeng-Yen Tsai

Jeng-Yen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Convex insert ring for etch chamber
    Patent number: 7381293
    Abstract: A new and improved insert ring for a wafer support inside a processing chamber for the processing, particularly dry etching, of semiconductor wafer substrates. The insert ring includes a generally convex inner surface which faces the wafer support and defines a gap or berline wall between the insert ring and the wafer support. In one embodiment, the convex inner surface is convexly-tapered. In another embodiment, the convex inner surface is convexly-curved. Throughout etching of multiple successive substrates on the wafer support, accumulations of polymer material on the inner surface of the insert ring are prevented or at least substantially reduced. Consequently, polymer peeling is eliminated or reduced and operational intervals for the processing chamber or system between periodic maintenance or cleanings, are prolonged.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: June 3, 2008
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Yi Wang, Jeng-Yen Tsai, Jeng-Chiang Chuang, Chon-Yai Tasi
  • Convex insert ring for etch chamber
    Publication number: 20040134617
    Abstract: A new and improved insert ring for a wafer support inside a processing chamber for the processing, particularly dry etching, of semiconductor wafer substrates. The insert ring includes a generally convex inner surface which faces the wafer support and defines a gap or berline wall between the insert ring and the wafer support. In one embodiment, the convex inner surface is convexly-tapered. In another embodiment, the convex inner surface is convexly-curved. Throughout etching of multiple successive substrates on the wafer support, accumulations of polymer material on the inner surface of the insert ring are prevented or at least substantially reduced. Consequently, polymer peeling is eliminated or reduced and operational intervals for the processing chamber or system between periodic maintenance or cleanings, are prolonged.
    Type: Application
    Filed: January 9, 2003
    Publication date: July 15, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Yi Wang, Jeng-Yen Tsai, Jeng-Chiang Chuang, Chon-Yai Tasi