Patents by Inventor Jeng-Yi Wu

Jeng-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230226661
    Abstract: The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 ?m to 10 ?m. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 20, 2023
    Inventors: I-PENG YAO, YUNG-CHANG HUNG, HSIEN-CHANG HUNG, LYANG-GUNG WANG, HSIN-RU SONG, JENG YI WU, CHI CHE HUANG
  • Publication number: 20040002951
    Abstract: The present invention provides a system and a method for automatically processing a plurality of information platform states, such as servers, network device and database. Each information platform respectively has at least one state file. The state file records the states of the information platform in a unified format. The state files are received from information platforms through a single transmission protocol and analyzed to determine whether a notification should be sent to a receiver. An electronic notification then is transmitted to the receiver. The present invention also provides a unified interface for presenting information. The present invention reduces managing complexity and costs, and increases productivity.
    Type: Application
    Filed: May 2, 2003
    Publication date: January 1, 2004
    Inventors: Jeng-Yi Wu, Yen-Hua Chen, Hsiao-Hung Chin