Patents by Inventor Jeng-Yuan Chang

Jeng-Yuan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6995985
    Abstract: A multi-layer printed circuit board includes at least a ground plane for providing a ground level, at least a signal plane having a plurality of trace regions for transmitting signals, at least a power plane region having a plurality of power blocks for individually providing a plurality of voltage levels, and at least a via for electrically connecting the trace regions with the power plane region or the ground plane. Two adjacent power blocks with different voltage levels are separated by an insulating line. The insulating line has a plurality of first insulating sectors, and a plurality of second insulating sectors for connecting two adjacent first insulating sectors when an included angle of the adjacent first insulating sectors is greater than a predetermined value.
    Type: Grant
    Filed: May 5, 2003
    Date of Patent: February 7, 2006
    Assignee: VIA Technologies Inc.
    Inventors: Ming-Chou Wu, Chi-Te Tai, Ming-Wei Huang, Jeng-Yuan Chang
  • Publication number: 20030223208
    Abstract: A multi-layer printed circuit board includes at least a ground plane for providing a ground level, at least a signal plane having a plurality of trace regions for transmitting signals, at least a power plane region having a plurality of power blocks for individually providing a plurality of voltage levels, and at least a via for electrically connecting the trace regions with the power plane region or the ground plane. Two adjacent power blocks with different voltage levels are separated by an insulating line. The insulating line has a plurality of first insulating sectors, and a plurality of second insulating sectors for connecting two adjacent first insulating sectors when an included angle of the adjacent first insulating sectors is greater than a predetermined value.
    Type: Application
    Filed: May 5, 2003
    Publication date: December 4, 2003
    Inventors: Ming-Chou Wu, Chi-Te Tai, Ming-Wei Huang, Jeng-Yuan Chang