Patents by Inventor Jeng-Hao Pai

Jeng-Hao Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of photosensitized Epon epoxy resin 1002F for MEMS and bioMEMS applications
    Patent number: 8748085
    Abstract: Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: June 10, 2014
    Assignee: The Regents of the University of California
    Inventors: Jeng-Hao Pai, Yuli Wang, Christopher E. Sims, Mark Bachman, Nancy Allbritton, Guann-Pyng Li
  • USE OF PHOTOSENSITIZED EPON EPOXY RESIN 1002F FOR MEMS AND BIOMEMS APPLICATIONS
    Publication number: 20110223545
    Abstract: Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.
    Type: Application
    Filed: July 25, 2008
    Publication date: September 15, 2011
    Inventors: Jeng-Hao Pai, Yuli Wang, Christopher E. Sims, Mark Bachman