Abstract: Provided are a 3-dimensional electronic device and a method for manufacturing the 3-dimensional electronic device. The method includes coupling semiconductor chips and guide blocks onto a substrate, forming an upper mold layer and upper wires on the semiconductor chips and the guide blocks by using a 3D printing method, stacking substrates other than the substrate on the upper mold layer and the upper wires, sawing a portion of each of the guide blocks and the upper mold layer, and forming a side mold layer and side wires on sidewalls of via electrodes of the guide blocks by using the 3D printing method.