Patents by Inventor Jenn-Dong Hwang

Jenn-Dong Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9123857
    Abstract: A thermoelectric material and a method for manufacturing the same are provided. The thermoelectric material includes a mixture of nano-thermoelectric crystal particles, micron-thermoelectric crystal particles and nano-metal particles.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: September 1, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsu-Shen Chu, Jenn-Dong Hwang, Chia-Chan Hsu, Tse-Hsiao Lee, Hong-Bin Wang
  • Patent number: 9048388
    Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: June 2, 2015
    Assignee: CHINA STEEL CORPORATION
    Inventors: Jing-Yi Huang, Huey-Lin Hsieh, Tung-Han Chuang, Jenn-Dong Hwang, Chao-Chi Jain
  • Publication number: 20140305483
    Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.
    Type: Application
    Filed: July 8, 2013
    Publication date: October 16, 2014
    Inventors: Jing-Yi HUANG, Huey-Lin HSIEH, Tung-Han CHUANG, Jenn-Dong HWANG, Chao-Chi JAIN
  • Patent number: 8785026
    Abstract: A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: July 22, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Hsien-Lin Hu, Jenn-Dong Hwang, Cheng-Chou Wong, Chin-Chuan Chang, Sheng-Fa Yeh, Bing-Ming Lin, Yu-Min Peng
  • Publication number: 20140174492
    Abstract: A thermoelectric material and a method for manufacturing the same are provided. The thermoelectric material includes a mixture of nano-thermoelectric crystal particles, micron-thermoelectric crystal particles and nano-metal particles.
    Type: Application
    Filed: July 18, 2013
    Publication date: June 26, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsu-Shen Chu, Jenn-Dong Hwang, Chia-Chan Hsu, Tse-Hsiao Lee, Hong-Bin Wang
  • Publication number: 20130152990
    Abstract: A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.
    Type: Application
    Filed: November 4, 2012
    Publication date: June 20, 2013
    Inventors: Hong-Jen Lai, Jenn-Dong Hwang, Hsu-Shen Chu, Tung-Han Chuang, Chao-Chi Jain, Che-Wei Lin
  • Patent number: 8242372
    Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: August 14, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Sheng Leu, Chun-Kai Liu, Jenn-Dong Hwang, Jin-Bao Wu, Chih-Kuang Yu
  • Publication number: 20120167937
    Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.
    Type: Application
    Filed: August 1, 2011
    Publication date: July 5, 2012
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Hsu-Shen Chu, Cheng-Chuan Wang, Jenn-Dong Hwang
  • Publication number: 20120132242
    Abstract: A thermoelectric generator apparatus disposed on a high-temperature surface of an object (as a heat source), at least includes a heat concentrator, a thermoelectric module and a cold-side heat sink. The heat concentrator has a top surface and a bottom surface contacting a high-temperature surface of the object, and an area of the bottom surface is smaller than that of the high-temperature surface. The thermoelectric module is disposed on the top surface of the heat concentrator. The cold-side heat sink is disposed on the thermoelectric module. Heat generated by the heat source is concentrated on the heat concentrator and flows to the hot side of the thermoelectric module for increasing the heat flux (Q?) passing the thermoelectric module and the hot side temperature of the thermoelectric module. Consequently, the thermoelectric conversion efficiency (?) is improved, and the power generation of the thermoelectric module is increased.
    Type: Application
    Filed: December 29, 2010
    Publication date: May 31, 2012
    Inventors: Hsu-Shen Chu, Jenn-Dong Hwang
  • Publication number: 20110159340
    Abstract: A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 30, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsien-Lin Hu, Jenn-Dong Hwang, Cheng-Chou Wong, Chin-Chuan Chang, Sheng-Fa Yeh, Bing-Ming Lin, Yu-Min Peng
  • Publication number: 20110149521
    Abstract: Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.
    Type: Application
    Filed: July 13, 2010
    Publication date: June 23, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Sheng Leu, Chun-Kai Liu, Jenn-Dong Hwang, Jin-Bao Wu, Chih-Kuang Yu
  • Patent number: 7952192
    Abstract: A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: May 31, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Chang Fann, Jenn-Dong Hwang, Cheng-Chou Wong
  • Publication number: 20100163782
    Abstract: A carbon-containing metal-based composite material and a manufacturing method thereof are provided. The carbon-containing metal-based composite material includes a plurality of graphites, a plurality of heat-conducting reinforcements and a metal matrix. The graphites occupy 35%˜90% in volume. The heat-conducting reinforcements are distributed between the graphites. The heat-conducting reinforcements and the graphites are self-bonded. The heat-conducting reinforcements occupy 5%˜30% in volume and have a thermal conductivity larger than 200 W/mK. The metal matrix is filled between the heat-conducting reinforcements and the graphites, and the metal matrix occupies 5%˜35% in volume.
    Type: Application
    Filed: September 3, 2009
    Publication date: July 1, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Chung Chang, Jenn-Dong Hwang, Hsien-Lin Hu, Chih-Chung Tu
  • Publication number: 20090236729
    Abstract: A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C.
    Type: Application
    Filed: June 3, 2009
    Publication date: September 24, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chang Fann, Jenn-Dong Hwang, Cheng-Chou Wong