Patents by Inventor Jenna Averhoff

Jenna Averhoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12666544
    Abstract: A system is disclosed. The system includes a panel comprising a printed circuit board (PCB) and a first panel side comprising a first interlock length configured to interlock with a first rail element. The first interlock length includes a projection that interlocks within a corresponding recess of the first rail element, wherein the first interlock length is configured to interlock with the first rail element and be removed from the first rail element without damaging the PCB or the projection. The system may further include the first rail element.
    Type: Grant
    Filed: February 13, 2024
    Date of Patent: June 23, 2026
    Assignee: Rockwell Collins, Inc.
    Inventors: John A. Bauer, Jenna Averhoff, David A. Rafson, Brian C. Stevens
  • Publication number: 20250261315
    Abstract: A system is disclosed. The system includes a panel comprising a printed circuit board (PCB) and a first panel side comprising a first interlock length configured to interlock with a first rail element. The first interlock length includes a projection that interlocks within a corresponding recess of the first rail element, wherein the first interlock length is configured to interlock with the first rail element and be removed from the first rail element without damaging the PCB or the projection. The system may further include the first rail element.
    Type: Application
    Filed: February 13, 2024
    Publication date: August 14, 2025
    Inventors: John A. Bauer, Jenna Averhoff, David A. Rafson, Brian C. Stevens