Patents by Inventor Jennie S. Hwang
Jennie S. Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10105794Abstract: A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: GrantFiled: March 23, 2018Date of Patent: October 23, 2018Assignee: ANTAYA TECHNOLOGIES CORPORATIONInventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Publication number: 20180207753Abstract: A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: ApplicationFiled: March 23, 2018Publication date: July 26, 2018Inventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Patent number: 9975207Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: GrantFiled: May 28, 2014Date of Patent: May 22, 2018Assignee: Antaya Technologies CorporationInventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Publication number: 20170190004Abstract: A solder composition includes about 20% to about 25% by weight tin, about 0.03% to about 3% by weight nickel, about 66% to about 75% by weight indium, and about 0.5% to about 2% by weight silver. The solder composition can further include about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.2% to about 6% by weight zinc, and/or about 0.01% to about 0.3% by weight germanium. The solder composition can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: ApplicationFiled: March 20, 2017Publication date: July 6, 2017Inventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Publication number: 20140271343Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Applicant: Antaya Technologies Corp.Inventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Patent number: 8771592Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: GrantFiled: February 1, 2012Date of Patent: July 8, 2014Assignee: Antaya Technologies Corp.Inventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Publication number: 20120222893Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.Type: ApplicationFiled: February 1, 2012Publication date: September 6, 2012Applicant: Antaya Technologies CorporationInventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
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Publication number: 20040241039Abstract: Disclosed is a high temperature, high performance lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, and antimony and having a liquidus temperature above 215° C. More particularly, several lead-free solder alloys are disclosed that comprise about (i) at least about 90% Sn, 0.2 to 5.0% Cu, 0.05 to 5.0% Bi; or (ii) at least about 75% Sn, 0.5 to 7.0% Cu, 0.05 to 18% Sb; or (iii) at least about 67% Sn, 3 to 15% Ag, 0.01 to 18% Sb; (iv) at least about 78% Sn, 0.8 to 7.0% Cu, 4 to 15% Ag; (v) at least about 96% Sn, and at least one of 0.01 to 2.0% Ni, and 0.01 to 2.0% Co; (vi) at least about 90% Sn, 0.05 to 5.0% Bi, and 0 to 5.0% Sb; and (vii) at least about 90% Sn, 0.2 to 0.9% Cu, and 0.1 to 5.0% Bi.Type: ApplicationFiled: June 22, 2004Publication date: December 2, 2004Applicant: H-Technologies GroupInventor: Jennie S. Hwang
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Publication number: 20020155024Abstract: Disclosed is a high temperature, high performance lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, and antimony and having a liquidus temperature above 215° C. More particularly, several lead-free solder alloys are disclosed that comprise about (i) at least about 90% Sn, 0.2 to 5.0% Cu, 0.05 to 5.0% Bi; or (ii) at least about 75% Sn, 0.5 to 7.0% Cu, 0.05 to 18% Sb; or (iii) at least about 67% Sn, 3 to 15% Ag, 0.01 to 18% Sb; (iv) at least about 78% Sn, 0.8 to 7.0% Cu, 4 to 15% Ag; (v) at least about 96% Sn, and at least one of 0.01 to 2.0% Ni, and 0.01 to 2.0% Co; (vi) at least about 90% Sn, 0.05 to 5.0% Bi, and 0 to 5.0% Sb; and (vii) at least about 90% Sn, 0.2 to 0.9% Cu, and 0.1 to 5.0% Bi.Type: ApplicationFiled: October 29, 2001Publication date: October 24, 2002Applicant: H-Technologies Group, Inc.Inventor: Jennie S. Hwang
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Patent number: 6176947Abstract: Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, indium, and antimony and having a melting temperature between 175-215° C.Type: GrantFiled: October 12, 1999Date of Patent: January 23, 2001Assignee: H-Technologies Group, IncorporatedInventors: Jennie S. Hwang, Zhenfeng Guo
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Patent number: 5985212Abstract: Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.01 and 9.5 weight percent Cu, between about 0.1 and 10.0 weight percent In, and optionally including one or more of the following elements: Zn in an amount of not greater than 9.0 weight percent, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent, Sb in an amount of not greater than 1.0 weight percent, Al in an amount of not greater than 1.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.5 and 6.5 weight percent Ag, between 0.5 and 8.0 weight percent Bi, and optionally including one or more of the following elements: between 0.1 and 10.0 weight percent In, Se or Te in an amount of not greater than 5.0 weight percent, Ga in an amount of not greater than 5.0 weight percent. Lead-free solder compositions consisting of at least 75.0 weight percent Sn, between 0.1 and 0.8 weight percent Ag, between 0.Type: GrantFiled: December 12, 1996Date of Patent: November 16, 1999Assignee: H-Technologies Group, IncorporatedInventors: Jennie S. Hwang, Holger J. Koenigsmann
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Patent number: 5520752Abstract: A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.Type: GrantFiled: June 20, 1994Date of Patent: May 28, 1996Assignee: The United States of America as represented by the Secretary of the ArmyInventors: George K. Lucey, Jr., James A. Wasynczuk, Roger B. Clough, Jennie S. Hwang
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Patent number: 4619715Abstract: There is provided an inorganic salt-free, anhydrous, noncorrosive powdered solder metal paste and vehicle therefor which vehicle is characterized by the presence therein of a nonaqueous resinous binder and a nonaqueous organic liquid composition having a surface tension or surface energy of from 43 to 65 dynes/cm. and higher at 20.degree. C. When powdered solder metal or powdered solder metal alloy is distributed in such a vehicle in an amount sufficient to form a paste, a deposit will not undergo hot slump at elevated temperatures. The pastes and vehicles are free of inorganic metal salts.Type: GrantFiled: December 9, 1985Date of Patent: October 28, 1986Assignee: SCM CorporationInventor: Jennie S. Hwang
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Patent number: 4557767Abstract: There is provided an inorganic salt-free, anhydrous, noncorrosive powdered solder metal paste and vehicle therefor which vehicle is characterized by the presence therein of a flux and a nonaqueous organic liquid having a surface tension or surface energy of from 43 to 65 dynes/cm. and higher at 20.degree. C. When powdered solder metal or powdered solder metal alloy is distributed in such a vehicle in an amount sufficient to form a paste, a deposit will not undergo hot slump at elevated temperatures. The pastes and vehicles are free of inorganic metal salts.Type: GrantFiled: September 11, 1984Date of Patent: December 10, 1985Assignee: SCM CorporationInventor: Jennie S. Hwang
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Patent number: 4541876Abstract: There is provided a nonaqueous powdered metal paste composition and a vehicle therefor, characterized by resistance to slumping upon heating to the fusion point of the metal, fusion point being above 500.degree. C., including the powdered metal, and an organic material having a surface tension of from 43 to 65 or higher dynes/cm. at 20.degree. C.Type: GrantFiled: September 11, 1984Date of Patent: September 17, 1985Assignee: SCM CorporationInventor: Jennie S. Hwang
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Patent number: 4460414Abstract: An essentially nonaqueous, water-rinsible, readily fusible vehicle for paste of powdered solder is comprised of a dispersion of flux consisting essentially of alkali metal hydroxide in liquid polyol and water soluble, normally solid synthetic wax.Type: GrantFiled: October 31, 1983Date of Patent: July 17, 1984Assignee: SCM CorporationInventor: Jennie S. Hwang
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Patent number: RE32309Abstract: There is provided an inorganic salt-free, anhydrous, noncorrosive powdered solder metal paste and vehicle therefor which vehicle is characterized by the presence therein of a flux and a nonaqueous organic liquid having a surface tension or surface energy of from 43 to 65 dynes/cm. and higher at 20.degree.C. When powdered solder metal or powdered solder metal alloy is distributed in such a vehicle in an amount sufficient to form a paste, a deposit will not undergo hot slump at elevated temperatures. The pastes and vehicles are free of inorganic metal salts.Type: GrantFiled: January 27, 1986Date of Patent: December 16, 1986Assignee: SCM CorporationInventor: Jennie S. Hwang