Patents by Inventor Jennifer A. Due

Jennifer A. Due has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Concave face wire bond capillary and method
    Patent number: 7677429
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: March 16, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • CONCAVE FACE WIRE BOND CAPILLARY AND METHOD
    Publication number: 20080302862
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Application
    Filed: August 22, 2008
    Publication date: December 11, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary and method
    Patent number: 7416107
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: August 26, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary and method
    Publication number: 20060032888
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Application
    Filed: October 7, 2005
    Publication date: February 16, 2006
    Inventors: Gregory Chapman, Michael Bettinger, Jennifer Due
  • Concave face wire bond capillary and method
    Patent number: 6966480
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: November 22, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary and method
    Publication number: 20040056072
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Application
    Filed: July 22, 2003
    Publication date: March 25, 2004
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary and method
    Patent number: 6595406
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: July 22, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary
    Publication number: 20020134819
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Application
    Filed: May 23, 2002
    Publication date: September 26, 2002
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary
    Patent number: 6439450
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: August 27, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary
    Publication number: 20020023943
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Application
    Filed: August 27, 2001
    Publication date: February 28, 2002
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary
    Patent number: 6311890
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: November 6, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Concave face wire bond capillary
    Patent number: 6158647
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: December 12, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due