Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

Abstract: The present disclosure relates to a dielectric composite may include a dielectric substrate overlying a reinforcement fabric layer. The dielectric substrate may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

Abstract: The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

Abstract: The present disclosure relates to a copper-clad laminate that may include a copper foil layer and a dielectric coating overlying the copper foil layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.

Abstract: The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Abstract: The present disclosure relates to a multifunctional film for a vacuum bag that may include a flexible barrier film that may include a textured surface. The multifunctional film may further include a release coating overlying the textured surface of the flexible barrier film. The multifunctional film may further have an oxygen (O2) permeability of not greater than about 1100 cc/(m2-day-atm) and a stability rating of not greater than about 90%, where the stability rating is defined as the maximum percent decrease in elongation at break as measured using ASTM D882 after being exposed to a temperature of 200° C. for 12 hours.

Abstract: The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.

Abstract: The present disclosure is directed to laser-markable insulation material and cable or wire assemblies containing such insulation material. In certain embodiments, the laser-markable insulation material can include a fluoropolymer and an inorganic laser-markable pigment. The pigment can have a mean crystal size in a range of about 0.4 microns to about 2 microns and/or a median particle size (d50) in a range of about 0.45 microns to about 2 microns. The insulation material can exhibit improved initial and heat-aged contrast ratios without diminishing the ability of a cable or wire containing the insulation material to meet industry standards for electric-arc tracking and propagation resistance.

Abstract: The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.

Abstract: The present disclosure relates to methods of making an article comprising PTFE, methods of making expanded articles comprising PTFE, articles comprising PTFE, and expanded articles comprising PTFE having improved mechanical and electrical performance and particularly reduced variability in mechanical, electrical and dimensional properties, particularly over long lengths.

Abstract: The present disclosure is directed to laser-markable insulation material and cable or wire assemblies containing such insulation material. In certain embodiments, the laser-markable insulation material can include a fluoropolymer and an inorganic laser-markable pigment. The pigment can have a mean crystal size in a range of about 0.4 microns to about 2 microns and/or a median particle size (d50) in a range of about 0.45 microns to about 2 microns. The insulation material can exhibit improved initial and heat-aged contrast ratios without diminishing the ability of a cable or wire containing the insulation material to meet industry standards for electric-arc tracking and propagation resistance.

Abstract: The present disclosure is directed to laser-markable insulation material and cable or wire assemblies containing such insulation material. In certain embodiments, the laser-markable insulation material can include a fluoropolymer and an inorganic laser-markable pigment. The pigment can have a mean crystal size in a range of about 0.4 microns to about 2 microns and/or a median particle size (d50) in a range of about 0.45 microns to about 2 microns. The insulation material can exhibit improved initial and heat-aged contrast ratios without diminishing the ability of a cable or wire containing the insulation material to meet industry standards for electric-arc tracking and propagation resistance.