Patents by Inventor Jennifer Bennett

Jennifer Bennett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144286
    Abstract: Techniques for patient medical care are disclosed. These techniques include identifying a plurality of rules relating to a purchase of a medical item. The techniques further include selecting a first rule, of the plurality of rules, to apply to the purchase, including generating a specificity score for each of the plurality of rules, based on setting one or more bit values in each specificity score using matching criteria between the respective rule and the purchase and comparing the specificity scores for the plurality of rules. The techniques further include facilitating supply of the medical item to a patient based on completing the purchase using the selected first rule.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Jennifer A. KEISER VOAS, Michael K. MILLER, Howard Ashley PIERCE-MORGAN, Dean BENNETT, Sam MAKONNEN, Stuart HOOD, Kim M. BECKER, Graham Macgregor PATERSON, Robert M. WRIGHT
  • Patent number: 11268809
    Abstract: A method adjusts a mechanical process on a material in order to improve bonding characteristics of the material. A system collects surface micro-roughness measurements of a material, and places discrete sampling regions on the material. The system analyzes the surface micro-roughness measurements for each of the discrete sampling regions on the material, and identifies a lowest micro-roughness measurement in a discrete sampling region from a plurality of discrete sampling regions on the material. The system compares the lowest micro-roughness measurement to a threshold micro-roughness measurement in order to determine that the lowest micro-roughness measurement is less than the threshold micro-roughness measurement.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: March 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Jennifer Bennett, James D. Bielick, David J. Braun, Timothy P. Younger, Theron L. Lewis, Stephen M. Hugo, John R. Dangler, Timothy A. Bartsch
  • Patent number: 11245238
    Abstract: A tool is provided for shaping contact tab interconnects at a circuit card edge. The tool includes a base member with a slot to receive a circuit card edge. The slot is sized such that the edge of the circuit card is slidable lengthwise within the slot. The tool further includes shaping dowels disposed within the base member, including at least two shaping dowels that define a set of adjacent shaping dowels extending at an angle relative to each other. The set of adjacent shaping dowels are exposed, at least in part, within the slot so that with lengthwise sliding of the edge of the circuit card within the slot, the edge of the circuit card contacts and slides across the set of adjacent shaping dowels rounding off, at least in part, ends of the contact tab interconnects at the edge of the circuit card.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: February 8, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy P. Younger, Theron L. Lewis, James D. Bielick, Jennifer Bennett, David J. Braun, Tim Bartsch, John R. Dangler, Stephen M. Hugo
  • Patent number: 10677856
    Abstract: Fabrication of a reliable circuit board assembly with press-fit connectors is facilitated by identifying a press-fit-connector-to-circuit board connection of a circuit board assembly for testing, with one or more press-fit connector pins of the connector being press-fit into one or more corresponding plated through-holes of the circuit board at a first surface of the circuit board. An electrically insulative liquid is applied at a second surface of the circuit board to the corresponding plated through-hole(s) with the press-fit pin(s), where the second surface and the first surface are opposite surfaces of the circuit board. Connection of the press-fit pin(s) to the corresponding plated through-hole(s) is tested to identify a connection failure, where the electrically insulative liquid facilitates identifying the connection failure. A fabrication adjustment to the circuit board assembly can be identified and implemented to address the identified connection failure.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler, Theron L. Lewis, Jennifer Bennett, Timothy P. Younger
  • Patent number: 10667433
    Abstract: A contained thermal interface material for pluggable applications, structures, and a method for implementing thermal coupling between components with a contained thermal interface material for pluggable applications are provided. A thermal interface material is combined with a metal member providing effective thermal coupling between components for plugging and unplugging thermal management applications.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: May 26, 2020
    Assignee: International Business Machines Corporation
    Inventors: Eric J. Campbell, Jennifer Bennett, Sarah K. Czaplewski-Campbell, Elin F. LaBreck
  • Publication number: 20200141726
    Abstract: A method adjusts a mechanical process on a material in order to improve bonding characteristics of the material. A system collects surface micro-roughness measurements of a material, and places discrete sampling regions on the material. The system analyzes the surface micro-roughness measurements for each of the discrete sampling regions on the material, and identifies a lowest micro-roughness measurement in a discrete sampling region from a plurality of discrete sampling regions on the material. The system compares the lowest micro-roughness measurement to a threshold micro-roughness measurement in order to determine that the lowest micro-roughness measurement is less than the threshold micro-roughness measurement.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 7, 2020
    Inventors: JENNIFER BENNETT, JAMES D. BIELICK, DAVID J. BRAUN, TIMOTHY P. YOUNGER, THERON L. LEWIS, STEPHEN M. HUGO, JOHN R. DANGLER, TIMOTHY A. BARTSCH
  • Publication number: 20200119507
    Abstract: Tools and methods are provided for shaping contact tab interconnects at a circuit card edge. The tool includes a base member with a slot to receive a circuit card edge. The slot is sized such that the edge of the circuit card is slidable lengthwise within the slot. The tool further includes shaping dowels disposed within the base member, including at least two shaping dowels that define a set of adjacent shaping dowels extending at an angle relative to each other. The set of adjacent shaping dowels are exposed, at least in part, within the slot. In operation, with lengthwise sliding of the edge of the circuit card within the slot, the edge of the circuit card contacts and slides across the set of adjacent shaping dowels to round off, at least in part, ends of the contact tab interconnects at the edge of the circuit card.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 16, 2020
    Inventors: Timothy P. YOUNGER, Theron L. LEWIS, James D. BIELICK, Jennifer BENNETT, David J. BRAUN, Tim BARTSCH, John R. DANGLER, Stephen M. HUGO
  • Patent number: 10593601
    Abstract: Embodiments of the invention include a dye and pry process for removing quad flat no-lead (QFN) packages and bottom termination components (BTC) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the QFN package or BTC. The package assembly is dried and a hole is drilled to expose a bottom surface of the QFN package or BTC. The QFN package or BTC is then removed by applying a force to the exposed bottom surface. The semiconductor package assembly can then be inspected for the dye to locate cracks.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: March 17, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tim A. Bartsch, Jennifer Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo, Theron L. Lewis, Timothy P. Younger
  • Patent number: 10575448
    Abstract: An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed circuit board and the heat sink disposed on a top surface of the logic chip. The apparatus further includes a first end of the first grounding member electrically coupled to the heat sink, wherein a second end of the grounding first member is disposed on a first ground land of the printed circuit board.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: February 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Theron L. Lewis, Timothy P. Younger, David J. Braun, James D. Bielick, Jennifer Bennett, Stephen M. Hugo, John R. Dangler
  • Publication number: 20200057102
    Abstract: Fabrication of a reliable circuit board assembly with press-fit connectors is facilitated by identifying a press-fit-connector-to-circuit board connection of a circuit board assembly for testing, with one or more press-fit connector pins of the connector being press-fit into one or more corresponding plated through-holes of the circuit board at a first surface of the circuit board. An electrically insulative liquid is applied at a second surface of the circuit board to the corresponding plated through-hole(s) with the press-fit pin(s), where the second surface and the first surface are opposite surfaces of the circuit board. Connection of the press-fit pin(s) to the corresponding plated through-hole(s) is tested to identify a connection failure, where the electrically insulative liquid facilitates identifying the connection failure. A fabrication adjustment to the circuit board assembly can be identified and implemented to address the identified connection failure.
    Type: Application
    Filed: August 17, 2018
    Publication date: February 20, 2020
    Inventors: Stephen M. HUGO, Tim BARTSCH, James D. BIELICK, David J. BRAUN, John R. DANGLER, Theron L. LEWIS, Jennifer BENNETT, Timothy P. YOUNGER
  • Publication number: 20190373774
    Abstract: A contained thermal interface material for pluggable applications, structures, and a method for implementing thermal coupling between components with a contained thermal interface material for pluggable applications are provided. A thermal interface material is combined with a metal member providing effective thermal coupling between components for plugging and unplugging thermal management applications.
    Type: Application
    Filed: June 4, 2018
    Publication date: December 5, 2019
    Inventors: Eric J. Campbell, Jennifer Bennett, Sarah K. Czaplewski-Campbell, Elin F. LaBreck
  • Publication number: 20190157169
    Abstract: Embodiments of the invention include a dye and pry process for removing quad flat no-lead (QFN) packages and bottom termination components (BTC) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the QFN package or BTC. The package assembly is dried and a hole is drilled to expose a bottom surface of the QFN package or BTC. The QFN package or BTC is then removed by applying a force to the exposed bottom surface. The semiconductor package assembly can then be inspected for the dye to locate cracks.
    Type: Application
    Filed: January 23, 2019
    Publication date: May 23, 2019
    Inventors: Tim A. Bartsch, Jennifer Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo, Theron L. Lewis, Timothy P. Younger
  • Patent number: 10262907
    Abstract: Embodiments of the invention include a dye and pry process for removing quad flat no-lead (QFN) packages and bottom termination components (BTC) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the QFN package or BTC. The package assembly is dried and a hole is drilled to expose a bottom surface of the QFN package or BTC. The QFN package or BTC is then removed by applying a force to the exposed bottom surface. The semiconductor package assembly can then be inspected for the dye to locate cracks.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: April 16, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tim A. Bartsch, Jennifer Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo, Theron L. Lewis, Timothy P. Younger
  • Patent number: 8919346
    Abstract: A radial artery of a patient is made accessible to an operator on the right side of the patient for performing a left radial artery accessed cardiac catheterization with a forearm and hand positioning device which includes first and second inflatable air bladders. The first air bladder extends longitudinally with an upper surface that, when the air bladder is inflated, supports and positions the forearm and hand of a patient with a radial artery of the patient remaining accessible to the operator. The second air bladder extends longitudinally beneath and is connected to the first air bladder and when inflated elevates the first air bladder and a forearm and hand of the patient held therein above a support for the patient's arm.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: December 30, 2014
    Inventor: Jennifer Bennett Carlin
  • Publication number: 20130037036
    Abstract: A radial artery of a patient is made accessible to an operator on the right side of the patient for performing a left radial artery accessed cardiac catheterization with a forearm and hand positioning device which includes first and second inflatable air bladders. The first air bladder extends longitudinally with an upper surface that, when the air bladder is inflated, supports and positions the forearm and hand of a patient with a radial artery of the patient remaining accessible to the operator. The second air bladder extends longitudinally beneath and is connected to the first air bladder and when inflated elevates the first air bladder and a forearm and hand of the patient held therein above a support for the patient's arm.
    Type: Application
    Filed: May 16, 2012
    Publication date: February 14, 2013
    Inventor: Jennifer Bennett Carlin
  • Publication number: 20060278240
    Abstract: Certain exemplary embodiments comprise a spatially distributed multimode optical fiber; a photodetector configured to detect optical signals provided from said fiber; a wireless digital module coupled to said photodetector and adapted to wirelessly transmit a wireless signal encoding a plurality of detected variables of the optical signals; a wireless receiver adapted to receive the wireless signal; and a signal processing module coupled to said wireless receiver and adapted to decode and interpret the plurality of detected variables of the optical signals.
    Type: Application
    Filed: November 17, 2003
    Publication date: December 14, 2006
    Inventors: William Spillman, Kenith Meissner, Jianmin Gong, Michael Mayer, Jennifer Bennett
  • Publication number: 20050176718
    Abstract: Aza- and polyaza-naphthalenyl carboxamide derivatives including certain quinoline carboxamide and naphthyridine carboxamide derivatives are described. These compounds are inhibitors of HIV integrase and inhibitors of HIV replication, and are useful in the prevention or treatment of infection by HIV and the treatment of AIDS, as compounds or pharmaceutically acceptable salts, or as ingredients in pharmaceutical compositions, optionally in combination with other antivirals, immunomodulators, antibiotics or vaccines. Methods of preventing, treating or delaying the onset of AIDS and methods of preventing or treating infection by HIV are also described.
    Type: Application
    Filed: February 11, 2005
    Publication date: August 11, 2005
    Inventors: Neville Anthony, Robert Gomez, Steven Young, Melissa Egbertson, John Wai, Linghang Zhuang, Mark Embrey, Lekhanh Tran, Jeffrey Melamed, H. Langford, James Guare, Thorsten Fisher, Samson Jolly, Michelle Kuo, Debra Perlow, Jennifer Bennett, Timothy Funk