Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

Abstract: A fastener head adapter includes a drive portion that can be engaged by a suitable driver, and a mating portion that is configured to mate with a fastener head. The fastener head adapter is attached to a fastener head. The fastener head adapter preferably provides a different type of drive portion than exists on the fastener head. Once the fastener head adapter is attached to the fastener head, the screw may then be turned by using the driver to engage the drive portion of the fastener head adapter and to turn the fastener head adapter, which in turn, turns the screw.

Abstract: A process of forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A process of forming a thermal interface material structure includes forming an assembly that includes a thermal interface material disposed between a first mating surface and a second mating surface. The first mating surface is associated with a module lid, and the second mating surface is associated with a heat sink. Protruding surface features are incorporated onto the first mating surface or the second mating surface. The process also includes compressing the assembly to form a thermal interface material structure. The thermal interface material structure includes the thermal interface material disposed within an interface defined by the first mating surface and the second mating surface. The protruding surface features protrude from the first mating surface or the second mating surface into selected areas of the interface to limit relative movement of the mating surfaces into the selected areas during thermal cycling to reduce thermal interface material migration out of the interface.

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

Abstract: A fastener head adapter includes a drive portion that can be engaged by a suitable driver, and a mating portion that is configured to mate with a fastener head. The fastener head adapter is attached to a fastener head. The fastener head adapter preferably provides a different type of drive portion than exists on the fastener head. Once the fastener head adapter is attached to the fastener head, the screw may then be turned by using the driver to engage the drive portion of the fastener head adapter and to turn the fastener head adapter, which in turn, turns the screw.

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

Abstract: An approach to reduce thermal cycling fatigue associated with an identified component in an electrical system. The approach includes a controller determining power to the electrical system is turned off and initiating power from an external power source to one or more heating elements in a vicinity of the identified component. The approach includes a controller receiving a first temperature from one or more temperature sensors in the vicinity of the identified component and determining whether the first temperature is within a predetermined temperature range. Responsive to the controller determining that the first temperature is not within the predetermined temperature range, the approach includes the controller adjusting a power level of the one or more heating elements.

Abstract: An approach to reduce thermal cycling fatigue associated with an identified component in an electrical system. The approach includes a controller determining power to the electrical system is turned off and initiating power from an external power source to one or more heating elements in a vicinity of the identified component. The approach includes a controller receiving a first temperature from one or more temperature sensors in the vicinity of the identified component and determining whether the first temperature is within a predetermined temperature range. Responsive to the controller determining that the first temperature is not within the predetermined temperature range, the approach includes the controller adjusting a power level of the one or more heating elements.