Patents by Inventor Jennifer L. Lund
Jennifer L. Lund has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7256670Abstract: A micro-electromechanical (MEM) RF switch provided with a deflectable membrane (60) activates a switch contact or plunger (40). The membrane incorporates interdigitated metal electrodes (70) which cause a stress gradient in the membrane when activated by way of a DC electric field. The stress gradient results in a predictable bending or displacement of the membrane (60), and is used to mechanically displace the switch contact (30). An RF gap area (25) located within the cavity (250) is totally segregated from the gaps (71) between the interdigitated metal electrodes (70). The membrane is electrostatically displaced in two opposing directions, thereby aiding to activate and deactivate the switch.Type: GrantFiled: August 26, 2002Date of Patent: August 14, 2007Assignee: International Business Machines CorporationInventors: Christopher V. Jahnes, Jennifer L. Lund, Katherine L. Saenger, Richard P. Volant
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Patent number: 7212091Abstract: A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.Type: GrantFiled: February 8, 2005Date of Patent: May 1, 2007Assignee: International Business Machines CoprorationInventors: Panayotis Constantinou Andricacos, L. Paivikki Buchwalter, Hariklia Deligianni, Robert A. Groves, Christopher Jahnes, Jennifer L. Lund, Michael Meixner, David Earle Seeger, Timothy D. Sullivan, Ping-Chuan Wang
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Patent number: 7045372Abstract: A method and structure that provides a battery within an integrated circuit for providing voltage to low-current electronic devices that exist within the integrated circuit. The method includes Front-End-Of-Line (FEOL) processing for generating a layer of electronic devices on a semiconductor wafer, followed by Back-End-Of-Line (BEOL) integration for wires connecting the electronic devices together to form completed electrical circuits of the integrated circuit. The BEOL integration includes forming a multilayered structure of wiring levels on the layer of electronic devices. Each wiring level includes conductive metallization (e.g., metal-plated vias, conductive wiring lines, etc.) embedded in insulative material. The battery is formed during BEOL integration within one or more wiring levels, and the conductive metallization conductively couples positive and negative terminals of the battery to the electronic devices.Type: GrantFiled: August 2, 2003Date of Patent: May 16, 2006Assignee: International Business Machines CorporationInventors: Arne W. Ballantine, Robert A. Groves, Jennifer L. Lund, James S. Nakos, Michael B. Rice, Anthony K. Stamper
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Patent number: 6977569Abstract: A switch comprising a substrate, an elongated movable part, a pair of electrical contacts disposed at one side of said part, an actuation electrode disposed at the one side of the part and separated from the pair of electrical contacts, wherein the part, the contacts and the electrode are disposed on the substrate, wherein the elongated movable part is arranged and dimensioned such that the part is movable in a generally lateral direction toward the contacts; the movable part includes a central elongated member fixed to a head having an electrical contact disposed at the one side. One end of the movable part is attached to the substrate by means of various anchoring arrangements.Type: GrantFiled: August 11, 2004Date of Patent: December 20, 2005Assignee: International Business Machines CorporationInventors: Hariklia Deligianni, Christopher V. Jahnes, Jennifer L. Lund, Lawrence E. Larson
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Patent number: 6917268Abstract: A switch comprising a substrate, an elongated movable part, a pair of electrical contacts disposed at one side of said part, an actuation electrode disposed at the one side of the part and separated from the pair of electrical contacts, wherein the part, the contacts and the electrode are disposed on the substrate, wherein the elongated movable part is arranged and dimensioned such that the part is movable in a generally lateral direction toward the contacts; the movable part includes a central elongated member fixed to a head having an electrical contact disposed at the one side. One end of the movable part is attached to the substrate by means of various anchoring arrangements.Type: GrantFiled: December 31, 2001Date of Patent: July 12, 2005Assignee: International Business Machines CorporationInventors: Hariklia Deligianni, Christopher V. Jahnes, Jennifer L. Lund, Lawrence E. Larson
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Patent number: 6876282Abstract: A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.Type: GrantFiled: May 17, 2002Date of Patent: April 5, 2005Assignee: International Business Machines CorporationInventors: Panayotis Constantinou Andricacos, L. Paivikki Buchwalter, Hariklia Deligianni, Robert A. Groves, Christopher Jahnes, Jennifer L. Lund, Michael Meixner, David Earle Seeger, Timothy D. Sullivan, Ping-Chuan Wang
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Patent number: 6836029Abstract: A micro-electro mechanical switch having a restoring force sufficiently large to overcome stiction is described. The switch is provided with a deflectable conductive beam and multiple electrodes coated with an elastically deformable conductive layer. A restoring force which is initially generated by a single spring constant k0 upon the application of a control voltage between the deflectable beam and a control electrode coplanar to the contact electrodes is supplemented by adding to k0 additional spring constants k1, . . . , kn provided by the deformable layers, once the switch nears closure and the layers compress. In another embodiment, deformable, spring-like elements are used in lieu of the deformable layers.Type: GrantFiled: November 28, 2001Date of Patent: December 28, 2004Assignee: International Business Machines CorporationInventors: David R. Greenberg, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer L. Lund, Katherine L. Saenger, Richard P. Volant
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Patent number: 6762088Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: GrantFiled: January 3, 2003Date of Patent: July 13, 2004Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso
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Patent number: 6720230Abstract: A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP.Type: GrantFiled: September 10, 2002Date of Patent: April 13, 2004Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Melanie L. Carasso, Steven A. Cordes, Robert A. Groves, Jennifer L. Lund, Joanna Rosner
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Publication number: 20040021201Abstract: A method and structure that provides a battery within an integrated circuit for providing voltage to low-current electronic devices that exist within the integrated circuit. The method includes Front-End-Of-Line (FEOL) processing for generating a layer of electronic devices on a semiconductor wafer, followed by Back-End-Of-Line (BEOL) integration for wires the electronic devices together to form completed electrical circuits of the integrated circuit. The BEOL integration includes forming a multilayered structure of wiring levels on the layer of electronic devices. Each wiring level includes conductive metallization (e.g., metal-plated vias, conductive wiring lines, etc.) embedded in insulative material. The battery is formed during BEOL integration within one or more wiring levels, and the conductive metallization conductively couples positive and negative terminals of the battery to the electronic devices.Type: ApplicationFiled: August 2, 2003Publication date: February 5, 2004Inventors: Arne W. Ballantine, Robert A. Groves, Jennifer L. Lund, James S. Nakos, Michael B. Rice, Anthony K. Stamper
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Publication number: 20030214373Abstract: A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.Type: ApplicationFiled: May 17, 2002Publication date: November 20, 2003Inventors: Panayotis Constantinou Andricacos, L. Paivikki Buchwalter, Hariklia Deligianni, Robert A. Groves, Christopher Jahnes, Jennifer L. Lund, Michael Meixner, David Earle Seeger, Timothy D. Sullivan, Ping-Chuan Wang
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Patent number: 6650000Abstract: A method and structure that provides a battery within an integrated circuit for providing voltage to low-current electronic devices that exist within the integrated circuit. The method includes Front-End-Of-Line (FEOL) processing for generating a layer of electronic devices on a semiconductor wafer, followed by Back-End-Of-Line (BEOL) integration for wires connecting the electronic devices together to form completed electrical circuits of the integrated circuit. The BEOL integration includes forming a multilayered structure of wiring levels on the layer of electronic devices. Each wiring level includes conductive metallization (e.g., metal-plated vias, conductive wiring lines, etc.) embedded in insulative material. The battery is formed during BEOL integration within one or more wiring levels, and the conductive metallization conductively couples positive and negative terminals of the battery to the electronic devices.Type: GrantFiled: January 16, 2001Date of Patent: November 18, 2003Assignee: International Business Machines CorporationInventors: Arne W. Ballantine, Robert A. Groves, Jennifer L. Lund, James S. Nakos, Michael B. Rice, Anthony K. Stamper
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Patent number: 6639488Abstract: Disclosed is a capacitive electrostatic MEMS RF switch comprised of a lower electrode that acts as both a transmission line and as an actuation electrode. Also, there is an array of one or more fixed beams above the lower electrode that is connected to ground. The lower electrode transmits the RF signal when the top beam or beams are up and when the upper beams are actuated and bent down, the transmission line is shunted to ground ending the RF transmission. A high dielectric constant material is used in the capacitive portion of the switch to achieve a high capacitance per unit area thus reducing the required chip area and enhancing the insertion loss characteristics in the non-actuated state. A gap between beam and lower electrode of less than 1 &mgr;m is incorporated in order to minimize the electrostatic potential (pull-in voltage) required to actuate the switch.Type: GrantFiled: September 7, 2001Date of Patent: October 28, 2003Assignee: IBM CorporationInventors: Hariklia Deligianni, Robert Groves, Christopher Jahnes, Jennifer L. Lund, Panayotis Andricacos, John Cotte, L. Paivikki Buchwalter, David Seeger, Raul E. Acosta
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Publication number: 20030122640Abstract: A switch comprising a substrate, an elongated movable part, a pair of electrical contacts disposed at one side of said part, an actuation electrode disposed at the one side of the part and separated from the pair of electrical contacts, wherein the part, the contacts and the electrode are disposed on the substrate, wherein the elongated movable part is arranged and dimensioned such that the part is movable in a generally lateral direction toward the contacts; the movable part includes a central elongated member fixed to a head having an electrical contact disposed at the one side. One end of the movable part is attached to the substrate by means of various anchoring arrangements.Type: ApplicationFiled: December 31, 2001Publication date: July 3, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Christopher V. Jahnes, Jennifer L. Lund, Lawrence E. Larson
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Publication number: 20030098618Abstract: A micro-electro mechanical switch having a restoring force sufficiently large to overcome stiction is described. The switch is provided with a deflectable conductive beam and multiple electrodes coated with an elastically deformable conductive layer. A restoring force which is initially generated by a single spring constant k0 upon the application of a control voltage between the deflectable beam and a control electrode coplanar to the contact electrodes is supplemented by adding to k0 additional spring constants k1, . . . , kn provided by the deformable layers, once the switch nears closure and the layers compress. In another embodiment, deformable, spring-like elements are used in lieu of the deformable layers.Type: ApplicationFiled: November 28, 2001Publication date: May 29, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David R. Greenberg, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes, Jennifer L. Lund, Katherine L. Saenger, Richard P. Volant
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Publication number: 20030096435Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: ApplicationFiled: January 3, 2003Publication date: May 22, 2003Inventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso
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Patent number: 6563464Abstract: A semiconductor device is presented which is composed of two adjacent semiconductor chips. Each semiconductor chip has an integrated half-wave dipole antenna structure located thereon. The semiconductor chips are oriented so that the half-wave dipole antenna segments extend away from each other, allowing the segments to be effectively mated and thus form a complete full-wave dipole antenna. The two solder bumps which form the antenna are separated by a gap of approximately 200 microns. The length of each solder bump antenna is based on the wavelength and the medium of collection. Phased array antenna arrays may also be constructed from a plurality of these semiconductor chip antennae.Type: GrantFiled: March 19, 2001Date of Patent: May 13, 2003Assignee: International Business Machines CorporationInventors: Arne W. Ballantine, Jennifer L. Lund, Anthony K. Stamper
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Patent number: 6534843Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: GrantFiled: February 10, 2001Date of Patent: March 18, 2003Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso
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Publication number: 20030048149Abstract: Disclosed is a capacitive electrostatic MEMS RF switch comprised of a lower electrode that acts as both a transmission line and as an actuation electrode. Also, there is an array of one or more fixed beams above the lower electrode that is connected to ground. The lower electrode transmits the RF signal when the top beam or beams are up and when the upper beams are actuated and bent down, the transmission line is shunted to ground ending the RF transmission. A high dielectric constant material is used in the capacitive portion of the switch to achieve a high capacitance per unit area thus reducing the required chip area and enhancing the insertion loss characteristics in the non-actuated state. A gap between beam and lower electrode of less than 1 &mgr;m is incorporated in order to minimize the electrostatic potential (pull-in voltage) required to actuate the switch.Type: ApplicationFiled: September 7, 2001Publication date: March 13, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hariklia Deligianni, Robert Groves, Christopher Jahnes, Jennifer L. Lund, Panayotis Andricacos, John Cotte, L. Paivikki Buchwalter, David Seeger, Raul E. Acosta
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Publication number: 20030011041Abstract: A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP.Type: ApplicationFiled: September 10, 2002Publication date: January 16, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Raul E. Acosta, Melanie L. Carasso, Steven A. Cordes, Robert A. Groves, Jennifer L. Lund, Joanna Rosner