Patents by Inventor Jennifer L. Wu

Jennifer L. Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240246147
    Abstract: In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.
    Type: Application
    Filed: April 5, 2024
    Publication date: July 25, 2024
    Inventors: Jason C. Hower, Mohammed S. Shaarawi, Vladek P. Kasperchik, James McKinnell, Jennifer L. Wu
  • Patent number: 11958110
    Abstract: In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jason C. Hower, Mohammed S. Shaarawi, Vladek P. Kasperchik, James McKinnell, Jennifer L. Wu
  • Publication number: 20230249258
    Abstract: According to examples, an apparatus may include a processor that may generate first print control data that may include instructions to deposit a binding liquid onto selected areas in an upper set of layers of build material particles. The processor may also determine areas in a lower set of layers of build material particles at which a non-binding liquid that does not include the binder to be deposited to define sections of a part enhancement section, the lower set of layers being within a predefined distance below the upper set of layers, in which the areas in the lower set of layers are based on the areas in the upper set of layers of build material particles at which the sections of the part are to be defined. The processor may further generate second print control data corresponding to the determined areas in the lower set of layers.
    Type: Application
    Filed: July 31, 2020
    Publication date: August 10, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Vladek Kasperchik, Jennifer L. Wu
  • Publication number: 20210245247
    Abstract: In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.
    Type: Application
    Filed: October 29, 2018
    Publication date: August 12, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jason C. Hower, Mohammed S. Shaarawi, Vladek P. Kasperchik, James McKinnell, Jennifer L. Wu
  • Patent number: 7571650
    Abstract: Various embodiments and methods relating to a pressure sensor having a flexure supported piezo resistive sensing element are disclosed.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: August 11, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James C. McKinnell, Eric L. Nikkel, Jennifer L. Wu, Adel B. Jilani
  • Publication number: 20090031818
    Abstract: Various embodiments and methods relating to a pressure sensor having a flexure supported piezo resistive sensing element are disclosed
    Type: Application
    Filed: July 30, 2007
    Publication date: February 5, 2009
    Inventors: James C. McKinnell, Eric L. Nikkel, Jennifer L. Wu, Adel B. Jilani
  • Publication number: 20080264553
    Abstract: Various embossing methods and apparatus are disclosed.
    Type: Application
    Filed: April 27, 2007
    Publication date: October 30, 2008
    Inventors: Jennifer L. Wu, Alan T. Davis