Abstract: Multi-modal sensing relating to joint acoustic emission and joint bioimpedance. Custom-design analog electronics and electrodes provide high resolution sensing of bioimpedance, microphones and their front-end electronics for capturing sound signals from the joints, rate sensors for identifying joint motions (linear and rotational), and a processor unit for interpretation of the signals. These components are packed into a wearable form factor, which also encapsulates the hardware required to minimize the negative effects of motion artifacts on the signals.

Abstract: Multi-modal sensing relating to joint acoustic emission and joint bioimpedance. Custom-design analog electronics and electrodes provide high resolution sensing of bioimpedance, microphones and their front-end electronics for capturing sound signals from the joints, rate sensors for identifying joint motions (linear and rotational), and a processor unit for interpretation of the signals. These components are packed into a wearable form factor, which also encapsulates the hardware required to minimize the negative effects of motion artifacts on the signals.

Abstract: Multi-modal sensing relating to joint acoustic emission and joint bioimpedance. Custom-design analog electronics and electrodes provide high resolution sensing of bioimpedance, microphones and their front-end electronics for capturing sound signals from the joints, rate sensors for identifying joint motions (linear and rotational), and a processor unit for interpretation of the signals. These components are packed into a wearable form factor, which also encapsulates the hardware required to minimize the negative effects of motion artifacts on the signals.

Abstract: Multi-modal sensing relating to joint acoustic emission and joint bioimpedance. Custom-design analog electronics and electrodes provide high resolution sensing of bioimpedance, microphones and their front-end electronics for capturing sound signals from the joints, rate sensors for identifying joint motions (linear and rotational), and a processor unit for interpretation of the signals. These components are packed into a wearable form factor, which also encapsulates the hardware required to minimize the negative effects of motion artifacts on the signals.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize both internal and external connection complexity. Intelligent power management can enable the chip to be used for various imaging applications with strict power constraints, including forward-looking intra-vascular ultrasound imaging. The chip can use digital logic to control transmit and receive events to minimize power consumption and maximize image resolution. The chip can be integrated into a probe, or catheter, and requires minimal external connections. The chip can comprise integrated temperature control to prevent overheating.

Abstract: A CMUT on CMOS imaging chip is disclosed. The imaging chip can use direct connection, CMOS architecture to minimize both internal and external connection complexity. Intelligent power management can enable the chip to be used for various imaging applications with strict power constraints, including forward-looking intra-vascular ultrasound imaging. The chip can use digital logic to control transmit and receive events to minimize power consumption and maximize image resolution. The chip can be integrated into a probe, or catheter, and requires minimal external connections. The chip can comprise integrated temperature control to prevent overheating.