Patents by Inventor Jennifer Otero Aspuria

Jennifer Otero Aspuria has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing A Wafer
    Publication number: 20200203227
    Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structures The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome shaped chuck, breaking the perforations in the wafer.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 25, 2020
    Inventors: Jerry Gomez Cayabyab, Jennifer Otero Aspuria, Julian Carlo Barbadillo, Alvin Lopez Andaya