Abstract: Optical imaging apparatuses are provided having desired focal properties. An optical imaging apparatus can include at least one wafer level optical element, a spacer, a second wafer comprising a focus compensation standoff, and an electro-optical element. For some apparatuses, the focus compensation standoff may include an electro-optical element mounting surface having a roughness different from at least one other surface of the focus compensation standoff. Also described are methods of producing a plurality of optical imaging apparatuses. Some methods include providing an optical wafer having a first and second optical element, determining a first and second focal point of a first and second optical die; providing a second wafer having a first and second focus compensation standoff; and adjusting the heights of the first and second focus compensation standoffs to position a first and second electro-optical element at or near a first and second focal point, respectively.

Abstract: Optical imaging apparatus are provided having the desired focal properties, which can be manufactured and/or assembled at the wafer level.