Abstract: The present invention provides an aqueous electroplating solution. The aqueous electroplating solution includes a copper salt comprising a weight by weight percent of the electroplating solution between about 0.1% to about 2.5%. The electroplating solution also includes an inorganic acid having a dissociation constant of less than about 2.0, and comprising a weight by weight percent of the electroplating solution between about 0.1% to about 10%. The electroplating solution further includes a hydrogenated halide and a modulator, each that comprises a weight by weight percent of the electroplating solution between about 0.0001% to about 1%.

Abstract: A ULSI circuit chip comprising copper interconnects is provided with a corrosion protection passivating layer on the surface of the copper which layer is comprised of a self assembled organic monolayer formed from treating the copper surface with a dilute solution of, for example a thio-bisalkyl acetoacetonate. A similar layer can be formed under the copper to provide a barrier layer against copper migration.

Abstract: The present invention provides an electrolytic cell for use in a process for real time monitoring of a chemical bath used in the fabrication of a semiconductor wafer and having different metal ions therein. In one embodiment, the electrolytic cell comprises a fluid chamber having an inlet, an outlet and chamber walls, and channel electrodes coupled to the chamber walls. The inlet and outlet permit a throughflow of at least of a portion of the chemical bath. Each of the channel electrodes corresponds to one of the different metal ions. Each channel electrode is energized to a detection potential selected to provide electrical conduction when the corresponding different metal ion reaches a prescribed concentration.