Abstract: A substrate-based package semiconductor device is provided. The present disclosure further relates to a carrier including a plurality of non-singulated substrate-based package semiconductor devices and to a method of manufacturing the same. In embodiments in accordance with the present disclosure, the lowest insulating layer(s) has/have cavities arranged near and associated with one or more package terminals, and an inner wall of the cavities is covered with a conductive body that connects to the respective associated package terminal. Furthermore, the non-singulated substrate-based package semiconductor devices are separated by a separating region of the substrate, and the cavities are at least partially formed in the separating region.

Abstract: An apparatus includes a first inductive component connected in series with a first signal line of a differential signal path and configured to suppress residual electrostatic discharge (ESD) current spikes on the first signal line by using a first effective inductance. A second inductive component is connected in series to a second signal line of the differential signal path configured to suppress residual ESD current spikes on a second signal line of the differential signal path by using a second effective inductance. The first and second inductive components are configured to pass differential signals on the differential signal path by using inductive coupling between the first and second inductive components to provide a third effective inductance.