Abstract: An isolator ring is provided for a substrate support used in a substrate processing chamber. The substrate support comprises an annular ledge having a circumferential edge, and an inner perimeter sidewall. The isolator ring comprises an L-shaped dielectric ring comprising a laser textured surface; a horizontal leg capable of resting on the annular ledge of the support, and having a length that extends radially outward and stops short of the circumferential edge of the annular ledge; and a vertical leg abutting the inner perimeter sidewall of the support. A ring assembly includes the isolator ring and a deposition ring.

Abstract: A ring assembly is provided for a substrate support used in a substrate processing chamber, the substrate support comprising an annular ledge and an inner perimeter sidewall. In one version, the ring assembly comprises (i) an L-shaped isolator ring comprising a horizontal leg resting on the annular ledge of the support, and a vertical leg abutting the inner perimeter sidewall of the support, and (ii) a deposition ring comprising an annular band having an overlap ledge that overlaps the horizontal leg of the isolator ring. In another version, the deposition ring comprises a dielectric annular band that surrounds and overlaps the annular ledge of the support, and a bracket and fastener.

Abstract: A method of fabricating a component for a substrate processing chamber involves providing a preform having internal and external surfaces, and providing a mandrel having a textured surface with a pattern of textured features comprising protrusions and depressions. The internal surface of the preform component is contacted with the textured surface of mandrel, and a pressure is applied to the external surface of the preform. The pressure is sufficiently high to plastically deform the preform over the textured surface of the mandrel to form a component having a textured internal surface comprising the pattern of textured feature that are shaped and sized to adhere process residues generated in the processing of substrates.

Abstract: A component for a substrate processing chamber has a structure having an overlying metal coating. The metal coating has a plurality of electron beam textured features that are formed by scanning an electron beam across a surface of the metal coating. The electron beam textured features include a plurality of depressions and protuberances on the surface that are capable of accumulating process deposits during processing of a substrate to reduce contamination of the substrate. The component having the metal coating provides improved processing results, and exhibits reduced erosion during cleaning processes performed to remove process deposits from the component.

Abstract: In a method of cleaning a surface of a substrate processing chamber component to remove process deposits, the component surface is cooled to a temperature below about ?40° C. to fracture the process deposits on the surface. The surface can be cooled by immersing the surface in a low temperature fluid, such as liquid nitrogen. In another version, the component surface is heated to fracture and delaminate the deposits, and optionally, subsequently rapidly cooled to form more fractures. The component surface cleaning can also be performed by bead blasting followed by a chemical cleaning step.