Patents by Inventor Jenny C. Lin

Jenny C. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250096045
    Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Inventors: Zuoming ZHU, Shu-Kwan LAU, Ala MORADIAN, Enle CHOO, Flora Fong-Song CHANG, Vilen K. NESTOROV, Zhiyuan YE, Bindusagar MARATH SANKARATHODI, Maxim D. SHAPOSHNIKOV, Surendra Singh SRIVASTAVA, Zhepeng CONG, Patricia M. LIU, Errol Antonio C. SANCHEZ, Jenny C. LIN, Schubert S. CHU, Balakrishnam R. JAMPANA
  • Patent number: 12196617
    Abstract: An apparatus for controlling temperature profile of a substrate within an epitaxial chamber includes a bottom center pyrometer and a bottom outer pyrometer to respectively measure temperatures at a center location and an outer location of a first surface of a susceptor of an epitaxy chamber, a top center pyrometer and a top outer pyrometer to respectively measure temperatures at a center location and an outer location of a substrate disposed on a second surface of the susceptor opposite the first surface, a first controller to receive signals, from the bottom center pyrometer and the bottom outer pyrometer, and output a feedback signal to a first heating lamp module that heats the first surface based on the measured temperatures of the first surface, and a second controller to receive signals, from the top center pyrometer, the top outer pyrometer, the bottom center pyrometer, and the bottom outer pyrometer, and output a feedback signal to a second heating lamp module that heats the substrate based on the mea
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: January 14, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Zuoming Zhu, Shu-Kwan Lau, Enle Choo, Ala Moradian, Flora Fong-Song Chang, Maxim D. Shaposhnikov, Bindusagar Marath Sankarathodi, Zhepeng Cong, Zhiyuan Ye, Vilen K. Nestorov, Surendra Singh Srivastava, Saurabh Chopra, Patricia M. Liu, Errol Antonio C. Sanchez, Jenny C. Lin, Schubert S. Chu
  • Patent number: 12165934
    Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: December 10, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Zuoming Zhu, Shu-Kwan Lau, Ala Moradian, Enle Choo, Flora Fong-Song Chang, Vilen K Nestorov, Zhiyuan Ye, Bindusagar Marath Sankarathodi, Maxim D. Shaposhnikov, Surendra Singh Srivastava, Zhepeng Cong, Patricia M. Liu, Errol C. Sanchez, Jenny C. Lin, Schubert S. Chu, Balakrishnam R. Jampana
  • Publication number: 20220155148
    Abstract: An apparatus for controlling temperature profile of a substrate within an epitaxial chamber includes a bottom center pyrometer and a bottom outer pyrometer to respectively measure temperatures at a center location and an outer location of a first surface of a susceptor of an epitaxy chamber, a top center pyrometer and a top outer pyrometer to respectively measure temperatures at a center location and an outer location of a substrate disposed on a second surface of the susceptor opposite the first surface, a first controller to receive signals, from the bottom center pyrometer and the bottom outer pyrometer, and output a feedback signal to a first heating lamp module that heats the first surface based on the measured temperatures of the first surface, and a second controller to receive signals, from the top center pyrometer, the top outer pyrometer, the bottom center pyrometer, and the bottom outer pyrometer, and output a feedback signal to a second heating lamp module that heats the substrate based on the mea
    Type: Application
    Filed: June 29, 2020
    Publication date: May 19, 2022
    Inventors: Zuoming ZHU, Shu-Kwan LAU, Enle CHOO, Ala MORADIAN, Flora Fong-Song CHANG, Maxim D. SHAPOSHNIKOV, Bindusagar MARATH SANKARATHODI, Zhepeng CONG, Zhiyuan YE, Vilen K. NESTOROV, Surendra Singh SRIVASTAVA, Saurabh CHOPRA, Patricia M. LIU, Errol Antonio C. SANCHEZ, Jenny C. LIN, Schubert S. CHU
  • Publication number: 20210028075
    Abstract: A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device configured to receive the first radiation signal.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Inventors: Zuoming ZHU, Shu-Kwan LAU, Ala MORADIAN, Enle CHOO, Flora Fong-Song CHANG, Vilen K. NESTOROV, Zhiyuan YE, Bindusagar MARATH SANKARATHODI, Maxim D. SHAPOSHNIKOV, Surendra Singh SRIVASTAVA, Zhepeng CONG, Patricia M. LIU, Errol C. SANCHEZ, Jenny C. LIN, Schubert S. CHU, Balakrishnam R. JAMPANA
  • Patent number: 7026238
    Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: April 11, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen, Christophe Marcadal, Jenny C. Lin
  • Publication number: 20040209460
    Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
    Type: Application
    Filed: May 7, 2004
    Publication date: October 21, 2004
    Inventors: Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen, Christophe Marcadal, Jenny C. Lin
  • Publication number: 20020060363
    Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
    Type: Application
    Filed: January 17, 2002
    Publication date: May 23, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen, Christophe Marcadal, Jenny C. Lin