Abstract: A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board. The solder stamp has a basic body having an end area and a protrusion, which protrudes out of the end area. The solder application to create solder paste dots of diameters as small as 10-300 ?m.

Abstract: A method for repairing a circuit board having at least one defective component, wherein the defective component is connected via at least one circuit board side, contact location mechanically and/or electrically with the circuit board including: removing the defective component from the circuit board cleaning the at least one circuit board side, contact location; applying a solder paste on the at least one cleaned circuit board side, contact location by means of a solder application stamp, wherein the solder application stamp first in a wetting step is brought at least partially into a reservoir with solder paste for wetting with the solder paste and then the wetted solder application stamp in a transfer step is brought onto the at least one desired circuit board side, contact location, so that solder paste is applied on the at least one circuit board side, contact location; populating the circuit board with a substitute component previously provided for the defective component; and soldering the substitute c