Patents by Inventor Jenny Sun

Jenny Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060207888
    Abstract: A method for electrochemically etching a metal layer deposited on a dielectric with an etch resist layer pattern to form circuitry for high density interconnect electronic modules using a nonactive electrolyte solution is described. The method is particularly useful for printed wiring boards, chip scale packages, wafer level packages and the like. The circuit tracks generally range from 50 to 125 micrometers for printed wiring boards, from 5 to 50 micrometers for chip scale packages, and from 0.1 to 5 micrometers for wafer level packages. In one embodiment of the invention the metal layer is copper and the nonactive electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.
    Type: Application
    Filed: February 15, 2006
    Publication date: September 21, 2006
    Inventors: E. Taylor, Jenny Sun, Heather McCrabb
  • Publication number: 20050205429
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 22, 2005
    Inventors: Lawrence Gebhart, Jenny Sun, Phillip Miller, E. Taylor
  • Publication number: 20050145506
    Abstract: A method for electrochemically etching a metal layer deposited on a dielectric with an etch resist layer pattern to form circuitry for high density interconnect electronic modules using a nonactive electrolyte solution is described. The method is particularly useful for printed wiring boards, chip scale packages, wafer level packages and the like. The circuit tracks generally range from 50 to 125 micrometers for printed wiring boards, from 5 to 50 micrometers for chip scale packages, and from 0.1 to 5 micrometers for wafer level packages. In one embodiment of the invention the metal layer is copper and the nonactive electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.
    Type: Application
    Filed: December 29, 2003
    Publication date: July 7, 2005
    Inventors: E. Taylor, Jenny Sun