Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

Abstract: A fan module is disposed in an electrical device. The electrical device has a main board and a casing. The fan module includes a vane module, a fan motor, a circuit board and a fan housing. The vane module has a hub and a plurality of vanes disposed around the edge of the hub. The fan motor is disposed in the hub. The circuit board is used to control the fan motor, so that the vanes rotate related to an axis of the hub for generating an air flow. The fan housing has a main body portion, a protruding portion and a fixing portion, wherein the protruding portion is located in a side of the main body portion, the vane module and the fan motor are disposed in the main body portion and the circuit board is disposed in the protruding portion.

Abstract: An electronic device and a power saving method thereof are provided. The electronic device includes a network module and a power saving module, wherein the network module connects to an access point (AP). The method includes executing an AP search operation at a predetermined time interval by the network module, and determining whether the electronic device is in a specific state by the power saving module. The method also includes disabling the network module from executing the AP search operation as long as the electronic device is still in the specific state. As a result, the unnecessary AP search operations can be avoided, and the purpose of saving power can be achieved.

Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

Abstract: The present invention relates to a method for auto-regulating the fan speed. The method includes detecting the temperature of a thermal source. When the temperature of the thermal source exceeds a target value, the fan speed of the fan is regulated according to a relation between the temperature of the thermal source and the fan speed of the fan. Thereafter, the voltage applied to the fan is micro-adjusted through a feedback control mechanism so that the fan speed of the fan reaches a specified speed in steps.

Abstract: A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

Abstract: A cooler module includes a heat pipe, which has one end terminating in a heat absorbing section that has at least one pane closely attached to the CPU to absorb heat from the CPU and a relatively greater metal wall thickness than the metal wall thickness of the heat pipe, and a heat sink connected to the other end of the heat pipe for dissipating heat absorbed from the CPU by the heat absorbing section of the heat pipe. The invention also provides a heat pipe for use in such a cooler module.

Abstract: A heat dissipation structure configured to couple with an interface card is provided. The heat dissipation structure comprises a first heat conduction portion arranged above a first surface of a wired board of the interface card, a second heat conduction portion arranged above a second surface of the wired board opposite the first surface thereof, and a heat convection portion connecting the first and the second heat conduction portions. Both the first and the second heat conduction portions comprise a plurality of contact leads used to contact the heat-generating electronic components disposed on the two surfaces of the wired board. The heat convection portion has a plurality of first bending strips and a plurality of second bending strips that are alternatively arranged, and a plurality of heat convection slots are formed between the first bending strips and the second bending strips.

Abstract: The present invention relates to a method for auto-regulating the fan speed. The method includes detecting the temperature of a thermal source. When the temperature of the thermal source exceeds a target value, the fan speed of the fan is regulated according to a relation between the temperature of the thermal source and the fan speed of the fan. Thereafter, the voltage applied to the fan is micro-adjusted through a feedback control mechanism so that the fan speed of the fan reaches a specified speed in steps.

Abstract: A peripheral device with thermal control circuitry is set within a casing of a portable computer. The peripheral device includes at least a peripheral processor set for providing specific operations, and pulse circuitry electrically connected to the peripheral processor for producing pulse signals with a predetermined first frequency and transmitting to the peripheral processor. The pulses are used so that the peripheral processor can operate according to a predetermined first operation velocity. The peripheral device also includes thermal control circuitry with a thermal sensor. When a temperature detected by the thermal sensor exceeds a first predetermined temperature, the thermal control circuitry produces a first output to the pulse circuitry so as to reduce the frequency of the pulse signals to a predetermined second frequency. This reduces the operating velocity of the peripheral processor to a second operating velocity.

Abstract: A peripheral device with thermal control circuitry is set within a casing of a portable computer. The peripheral device includes at least a peripheral processor set for providing specific operations, and pulse circuitry electrically connected to the peripheral processor for producing pulse signals with a predetermined first frequency and transmitting to the peripheral processor. The pulses are used so that the peripheral processor can operate according to a predetermined first operation velocity. The peripheral device also includes thermal control circuitry with a thermal sensor. When a temperature detected by the thermal sensor exceeds a first predetermined temperature, the thermal control circuitry produces a first output to the pulse circuitry so as to reduce the frequency of the pulse signals to a predetermined second frequency. This reduces the operating velocity of the peripheral processor to a second operating velocity.