Patents by Inventor Jenq-Yuan Lai

Jenq-Yuan Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having an exposed heat spreader
    Patent number: 6552428
    Abstract: A semiconductor package with an exposed heat spreader includes a substrate having a semiconductor chip adhered to a first surface of the substrate. The heat spreader includes an upper portion, a lower portion with an opening formed in the center for receiving the semiconductor chip, and a connecting portion for connecting the upper portion and the lower portion in a manner that the upper portion is raised to a height above the opening of the lower portion. The lower portion is formed with a plurality of positioning members outwardly extending from edges of the lower portion to prevent the heat spreader from being dislocated during a molding process, and further includes downward flutes formed on the periphery of the opening for enabling resin flow underneath the heat spreader. The upper portion of the heat spreader is exposed to an exterior of the semiconductor package to improve heat dissipation.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: April 22, 2003
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chien Ping Huang, Tom Tang, Kevin Chiang, Jenq-Yuan Lai, Candy Tien, Vicky Liu