Patents by Inventor Jens A. Riege
Jens A. Riege has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8758553Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.Type: GrantFiled: October 5, 2010Date of Patent: June 24, 2014Assignee: Skyworks Solutions, Inc.Inventors: Jens A. Riege, Steve Canale, David J. Zapp
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Patent number: 8481344Abstract: Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers.Type: GrantFiled: July 8, 2011Date of Patent: July 9, 2013Assignee: Skyworks Solutions, Inc.Inventors: Lam T. Luu, Shiban K. Tiku, Richard S. Bingle, Jens A. Riege, Heather L. Knoedler, Daniel C. Weaver
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Patent number: 8415770Abstract: Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate can include holes sized to dispense a particular plating solution, such as plating solution that includes gold, onto a wafer. The showerhead body can be coupled to the anode post and the showerhead anode plate. The showerhead body can be configured to create a seal sufficient to substantially prevent a reduction of pressure in the plating solution flowing from the anode post to holes of the showerhead anode plate.Type: GrantFiled: May 2, 2012Date of Patent: April 9, 2013Assignee: Skyworks Solutions, Inc.Inventors: Jens A. Riege, Heather L. Knoedler, Shiban K. Tiku
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Publication number: 20120211888Abstract: Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate can include holes sized to dispense a particular plating solution, such as plating solution that includes gold, onto a wafer. The showerhead body can be coupled to the anode post and the showerhead anode plate. The showerhead body can be configured to create a seal sufficient to substantially prevent a reduction of pressure in the plating solution flowing from the anode post to holes of the showerhead anode plate.Type: ApplicationFiled: May 2, 2012Publication date: August 23, 2012Applicant: Skyworks Solutions, Inc.Inventors: Jens A. Riege, Heather L. Knoedler, Shiban K. Tiku
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Patent number: 8188575Abstract: Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate can include holes sized to dispense a particular plating solution, such as plating solution that includes gold, onto a wafer. The showerhead body can be coupled to the anode post and the showerhead anode plate. The showerhead body can be configured to create a seal sufficient to substantially prevent a reduction of pressure in the plating solution flowing from the anode post to holes of the showerhead anode plate.Type: GrantFiled: October 5, 2010Date of Patent: May 29, 2012Assignee: Skyworks Solutions, Inc.Inventors: Jens A. Riege, Heather L. Knoedler, Shiban K. Tiku
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Publication number: 20120083118Abstract: Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers.Type: ApplicationFiled: July 8, 2011Publication date: April 5, 2012Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Lam T. Luu, Shiban K. Tiku, Richard S. Bingle, Jens A. Riege, Heather L. Knoedler, Daniel C. Weaver
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Publication number: 20120080150Abstract: Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.Type: ApplicationFiled: October 5, 2010Publication date: April 5, 2012Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Jens A. Riege, Steve Canale, David J. Zapp
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Publication number: 20120080790Abstract: Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate can include holes sized to dispense a particular plating solution, such as plating solution that includes gold, onto a wafer. The showerhead body can be coupled to the anode post and the showerhead anode plate. The showerhead body can be configured to create a seal sufficient to substantially prevent a reduction of pressure in the plating solution flowing from the anode post to holes of the showerhead anode plate.Type: ApplicationFiled: October 5, 2010Publication date: April 5, 2012Applicant: Skyworks Solutions, Inc.Inventors: Jens A. Riege, Heather L. Knoedler, Shiban K. Tiku
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Patent number: 8022448Abstract: Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers.Type: GrantFiled: October 5, 2010Date of Patent: September 20, 2011Assignee: Skyworks Solutions, Inc.Inventors: Lam T. Luu, Shiban K. Tiku, Richard S. Bingle, Jens A. Riege, Heather L. Knoedler, Daniel C. Weaver