Patents by Inventor Jens Albrecht

Jens Albrecht has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230051345
    Abstract: A flow measurement device for determining the flow rate of a fluid flowing in a line is provided, wherein the flow measurement device has a measurement element arranged at a measurement point in the line for a selective detection of a measurement value of the flowing fluid, a control and evaluation unit to determine the flow rate from the measurement value, and a flow guidance element arranged upstream of the measurement point with respect to the direction of flow. In this respect, the flow guidance element supplies a representative portion of the flow to the measurement point.
    Type: Application
    Filed: August 10, 2022
    Publication date: February 16, 2023
    Inventors: Jens ALBRECHT, Mario KÜNZELMANN
  • Publication number: 20220393653
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: August 17, 2022
    Publication date: December 8, 2022
    Inventors: Peter J. Zampardi, JR., Hongxiao Shao, Tin Myint Ko, Matthew Thomas Ozalas, Hong Shen, Mehran Janani, Jens Albrecht Riege, Hsiang-Chih Sun, David Steven Ripley, Philip John Lehtola
  • Patent number: 9955756
    Abstract: A shell element for the buckle cover of a seat belt buckle is disclosed. The shell element comprises a base body made of a hard elastomer and an outer and an inner surface. So that when the buckle cover bears against a further vehicle element with a hard surface, no wear and no undesirable noise is generated and so that the seat belt buckle permanently has attractive visual and haptic properties, a further element made of a soft elastomer is directly connected to the base body and is connected thereto by a material and/or positive connection, said further element forming at least one part of the outer surface of the shell element.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: May 1, 2018
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Ulrich Klafke, Mario Eckmann, Ole Scharnberg, Jens Albrecht, Sandra Kleinke, Wolf Ulrich Wachter
  • Patent number: 9755592
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to amplify a radio frequency (RF) signal and tantalum nitride terminated through wafer via. The power amplifier includes a heterojunction bipolar transistor and a p-type field effect transistor, in which a semiconductor portion of the p-type field effect transistor corresponds to a channel includes the same type of semiconductor material as a collector layer of the heterojunction bipolar transistor. A metal layer in the tantalum nitride terminated through wafer via is included in an electrical connection between the power amplifier on a front side of a substrate and a conductive layer on a back side of the substrate. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 5, 2017
    Assignee: Skyworks Solutions, Inc.
    Inventors: Peter J. Zampardi, Jr., Hsiang-Chih Sun, Hong Shen, Mehran Janani, Jens Albrecht Riege
  • Publication number: 20160380602
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier configured to amplify a radio frequency (RF) signal and tantalum nitride terminated through wafer via. The power amplifier includes a heterojunction bipolar transistor and a p-type field effect transistor, in which a semiconductor portion of the p-type field effect transistor corresponds to a channel includes the same type of semiconductor material as a collector layer of the heterojunction bipolar transistor. A metal layer in the tantalum nitride terminated through wafer via is included in an electrical connection between the power amplifier on a front side of a substrate and a conductive layer on a back side of the substrate. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: September 8, 2016
    Publication date: December 29, 2016
    Inventors: Peter J. Zampardi, JR., Hsiang-Chih Sun, Hong Shen, Mehran Janani, Jens Albrecht Riege
  • Publication number: 20150326183
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier die including a power amplifier configured to amplify a radio frequency (RF) signal, the power amplifier including a heterojunction bipolar transistor (HBT) and a p-type field effect transistor (PFET), the PFET including a semiconductor segment that includes substantially the same material as a layer of a collector of the HBT, the semiconductor segment corresponding to a channel of the PFET; a load line electrically connected to an output of the power amplifier and configured to provide impedance matching at a fundamental frequency of the RF signal; and a harmonic termination circuit electrically connected to the output of the power amplifier and configured to terminate at a phase corresponding to a harmonic frequency of the RF signal. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: April 14, 2015
    Publication date: November 12, 2015
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, JR., Guohao Zhang
  • Publication number: 20150326181
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: April 14, 2015
    Publication date: November 12, 2015
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, JR., Guohao Zhang
  • Publication number: 20150326182
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: April 14, 2015
    Publication date: November 12, 2015
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, JR., Guohao Zhang
  • Patent number: 9174991
    Abstract: The present invention relates to a new polymorphic or crystalline form of Pemetrexed Disodium, processes for its preparation and its use, in particular for the preparation of medicaments.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: November 3, 2015
    Assignees: Azad Pharmaceutical Ingredients AG, University of Zurich
    Inventors: Uwe Jens Albrecht, Hannes Helmboldt, Vsevolod Valerievich Nikolaev
  • Publication number: 20150233008
    Abstract: Apparatus and methods related to copper plating of wafers. In some implementations, a method for copper plating a wafer can include estimating a change in surface area exposed on a side of the wafer. The estimated change, such as an increase in surface area, can be based at least in part on a number of vias formed on the side of the wafer. The method can further include adjusting a plating parameter, such as a plating time interval, based on the estimated change. Additionally, a number of processing techniques can be implemented to reduce oxidation of the plated copper.
    Type: Application
    Filed: February 12, 2015
    Publication date: August 20, 2015
    Inventors: Jens Albrecht RIEGE, Patrick N. SANTOS
  • Patent number: 9041472
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: May 26, 2015
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, Jr., Guohao Zhang
  • Publication number: 20140002188
    Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Applicant: SKYWORKS SOLUTIONS, INC.
    Inventors: Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko, Philip John Lehtola, Anthony James LoBianco, Hardik Bhupendra Modi, Hoang Mong Nguyen, Matthew Thomas Ozalas, Sandra Louise Petty-Weeks, Matthew Sean Read, Jens Albrecht Riege, David Steven Ripley, Hongxiao Shao, Hong Shen, Weimin Sun, Hsiang-Chih Sun, Patrick Lawrence Welch, Peter J. Zampardi, JR., Guohao Zhang
  • Patent number: 8546048
    Abstract: A technique generating sloping resist profiles based on an exposure process uses a reticle having structures surrounded with first and second contrasting interleaved bands below the resolution limit of the stepper used to expose the resist. Exemplary embodiments include a reticle having interleaved, non-overlapping transparent and opaque bands surrounding a transparent feature with an innermost one of the opaque bands bordering the structure, such as a via opening or a metal conductors pattern, resulting in the patterned photoresist having sloped or tapered sides with consistent reproducibility. The slope in the photoresist is then transferred to the underlying layer during an etch using the tapered photoresist as a mask. Alternatively, the sloped resist can have a negative slope angle for patterning metal conductors using a metal lift-off technique.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: October 1, 2013
    Assignee: Skyworks Solutions, Inc.
    Inventor: Jens Albrecht Riege
  • Publication number: 20130022767
    Abstract: A shell element for the buckle cover of a seat belt buckle is disclosed. The shell element comprises a base body made of a hard elastomer and an outer and an inner surface. So that when the buckle cover bears against a further vehicle element with a hard surface, no wear and no undesirable noise is generated and so that the seat belt buckle permanently has attractive visual and haptic properties, a further element made of a soft elastomer is directly connected to the base body and is connected thereto by a material and/or positive connection, said further element forming at least one part of the outer surface of the shell element.
    Type: Application
    Filed: January 26, 2011
    Publication date: January 24, 2013
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventors: Ulrich Klafke, Mario Eckmann, Ole Scharnberg, Jens Albrecht, Sandra Kleinke, Wolf Ulrich Wachter
  • Publication number: 20120329819
    Abstract: The present invention relates to a new polymorphic or crystalline form of Pemetrexed Disodium, processes for its preparation and its use, in particular for the preparation of medicaments.
    Type: Application
    Filed: November 24, 2010
    Publication date: December 27, 2012
    Applicants: UNIVERSITY OF ZURICH, AZAD PHARMACEUTICAL INGREDIENTS AG
    Inventors: Uwe Jens Albrecht, Hannes Helmboldt, Vsevold Valerievich Nikolaev
  • Publication number: 20120145668
    Abstract: A technique generating sloping resist profiles based on an exposure process uses a reticle having structures surrounded with first and second contrasting interleaved bands below the resolution limit of the stepper used to expose the resist. Exemplary embodiments include a reticle having interleaved, non-overlapping transparent and opaque bands surrounding a transparent feature with an innermost one of the opaque bands bordering the structure, such as a via opening or a metal conductors pattern, resulting in the patterned photoresist having sloped or tapered sides with consistent reproducibility. The slope in the photoresist is then transferred to the underlying layer during an etch using the tapered photoresist as a mask. Alternatively, the sloped resist can have a negative slope angle for patterning metal conductors using a metal lift-off technique.
    Type: Application
    Filed: October 28, 2011
    Publication date: June 14, 2012
    Inventor: Jens Albrecht Riege