Patents by Inventor Jens Bachmann

Jens Bachmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080291867
    Abstract: The invention relates to a method for obtaining a home node address in a packet switched network comprising nodes. The method comprises the steps of a first node sending to a first home node of a home network a request containing information about a home address of a mobile node to determine whether a binding with said home address indicating a registration of said mobile node at the first home node exists; the first home node receiving the request, said first home node comprising a stored binding table; determining whether the binding with said home address exists in any home node of the home network; and if the home address of the mobile node is in the binding table of any of the home nodes in the home network, the first node receiving a reply comprising the address of the home node with said binding.
    Type: Application
    Filed: October 10, 2006
    Publication date: November 27, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Kilian Weniger, Jens Bachmann
  • Publication number: 20080253382
    Abstract: The invention relates to a method for node management in a packet-switched network, wherein a first node acts as a proxy for a second node, both nodes having network-layer addresses and link-layer addresses, the network-layer addresses at the network layer and the link-layer addresses at the link layer being used for communication in the packet-switched network. The method comprises the following steps performed by the first node: The first node receives from the second node a request to receive and forward packets addressed to the second node's network-layer address, whereby the same network-layer address is associated with the first node and the second node, and the first node and the second node have distinct link-layer addresses. The first node advertises to nodes attached to the packet-switched network the first node's link-layer address as a destination address for the second node's network-layer address, while the second node does not advertise.
    Type: Application
    Filed: January 8, 2006
    Publication date: October 16, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Jens Bachmann, Kilian Weniger
  • Publication number: 20080256220
    Abstract: The invention relates to a method performed by a home agent serving a mobile node in a home network of the mobile node upon attachment of a mobile node to the home network as well as to the home agent. Further, the invention also relates to a method for enabling simultaneous use of a plurality of interfaces by a mobile node being attached to a home network through one of the plurality of interfaces and to at least one foreign network through at least another interface of the plurality of interfaces. Moreover, the invention provides a mobile node and a proxy acting on behalf of the mobile node. To enable a mobile node to use a home network and at least one further foreign network for communications the invention suggests the registration of the mobile node's home address or of a network node within its home network as a care-of address in the home network.
    Type: Application
    Filed: August 17, 2006
    Publication date: October 16, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Jens Bachmann, Kilian Weniger, Rolf Hakenberg
  • Publication number: 20080198805
    Abstract: A method and a server acting as a Home Agent are provided for packet switched data transmission between a first mobile node and a correspondent mobile node in a mobile communication system comprising a plurality of mobile networks. Each of the first mobile node and the correspondent mobile node are allocated to respective home networks, and a network server is provided as a home agent to each mobile node, respectively. Then, data packets are routed from the first mobile node to the correspondent mobile node, over a first data tunnel from the first mobile node to any first one of the home agents and over a second data tunnel from said first one of the home agents to the correspondent mobile node without passing the respective other home agent.
    Type: Application
    Filed: April 28, 2006
    Publication date: August 21, 2008
    Inventors: Kilian Weniger, Jens Bachmann
  • Patent number: 7413993
    Abstract: The invention is concerned with a process for removing residue comprising a polymeric resist and metal oxide from a metal structure on a semiconductor substrate, the process comprising the steps of: (a) heating up the substrate with the metal structure in the presence of molecular nitrogen gas (N2); (b) a stabilization step in the presence of pure molecular nitrogen gas (N2); (c) a passivation step employing a plasma containing at least one of the group of water, nitrogen and oxygen; and (d) a stripping step containing oxygen to remove the residue, comprising resist.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: August 19, 2008
    Assignees: Infineon Technologies AG, Nanya Technology Corporation
    Inventors: Ronald Gottzein, Jens Bachmann, Dirk Efferenn, Uwe Kahler, Chung-Hsin Lin, Wen-Bin Lin, Lee Donohue
  • Publication number: 20080165740
    Abstract: The invention relates to a method for configuring connection parameters of a connection between a mobile terminal and a target wireless access network in a handover between heterogeneous wireless access networks, wherein the mobile terminal is handed over from an originating wireless access network to a target wireless access network. Moreover, the invention provides a packet data gateway and an authentication server which are adapted to participate and execute a part of the steps of the configuration method. To provide a solution for establishing connection to a wireless access network, as for example a WLAN, as fast as possible, in particular in a handover, the invention proposed to pre-configure a tunnel to be established between a packet data gateway and the mobile terminal for packet data service provision via the target wireless access network based on context information already maintained for the packet data service.
    Type: Application
    Filed: June 27, 2005
    Publication date: July 10, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Jens Bachmann, Rolf Hakenberg
  • Publication number: 20080095119
    Abstract: The invention relates to a method for configuring a context for a connection delivering a packet data service to a mobile terminal via a target wireless access network. The mobile terminal is initially connected to an originating wireless access network and the packet data service may be provided to the mobile terminal via the originating wireless network. Moreover, the invention provides an authentication server, a packet data gateway and a packet data service support node which participate in the context configuration method. To provide a method that allows establishing connection for packet service delivery to a mobile terminal from a wireless access network, as for example a UMTS, as fast as possible the invention suggests to preconfigure service provision of the packet data service via the target wireless access network by establishing a context prior to the mobile terminal connecting to the target wireless access network.
    Type: Application
    Filed: June 29, 2005
    Publication date: April 24, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Jens Bachmann, Rolf Hakenberg
  • Patent number: 7342314
    Abstract: The present invention provides a device having a useful structure which is arranged on a substrate and has a useful structure side edge. In addition, an auxiliary structure is arranged on the substrate adjacent to the useful structure, the auxiliary structure having an auxiliary structure side edge, wherein the useful structure side edge is opposite to the auxiliary structure side edge separated by a distance, and wherein the auxiliary structure useful structure distance is dimensioned such that a form of the useful structure side edge or a form of the substrate next to the useful structure side edge differs from a form in a device where there is no auxiliary structure.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: March 11, 2008
    Assignee: Infineon Technologies AG
    Inventors: Jens Bachmann, Klaus Goller, Dirk Grueneberg, Reiner Schwab
  • Publication number: 20070110009
    Abstract: The present invention relates to a method for a context transfer in a communication network comprising a plurality of heterogeneous access networks, (220, 221, 222) wherein a mobile terminal is attached to one of the access networks. Further, the present invention relates to a context transfer manager performing the method (220, 600). Moreover, the present invention relates to a mobile terminal specially adapted to perform the provided method for a context transfer. To facilitate a context transfer between heterogeneous access networks, the present invention introduces a context transfer manager generating at least one context based on capabilities and paramneters associated to the mobile terminal and capabilities and parameters of the neighboring access networks taking into account the respective access technology (FIG. 5).
    Type: Application
    Filed: October 26, 2004
    Publication date: May 17, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Jens Bachmann, Alexander Bourgett
  • Patent number: 7157381
    Abstract: A method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits includes the following steps: providing a substrate; providing a whisker-containing layer made of aluminum metal or an aluminum alloy on the substrate; back-etching and/or resputtering the whisker-containing layer such that the whiskers are essentially removed; and structuring the whisker-free layer into the lines.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: January 2, 2007
    Assignees: Infineon Technologies AG, Nanya Technology Corporation
    Inventors: Dirk Efferenn, Jens Hahn, Uwe Kahler, Chung-Hsin Lin, Jens Bachmann, Wen-Bin Lin, Grit Bonsdorf
  • Publication number: 20060108324
    Abstract: The invention is concerned with a process for removing residue comprising a polymeric resist and metal oxide from a metal structure on a semiconductor substrate, the process comprising the steps of: (a) heating up the substrate with the metal structure in the presence of molecular nitrogen gas (N2); (b) a stabilization step in the presence of pure molecular nitrogen gas (N2); (c) a passivation step employing a plasma containing at least one of the group of water, nitrogen and oxygen; and (d) a stripping step containing oxygen to remove the residue, comprising resist.
    Type: Application
    Filed: November 22, 2004
    Publication date: May 25, 2006
    Inventors: Ronald Gottzein, Jens Bachmann, Dirk Efferenn, Uwe Kahler, Chung-Hsin Lin, Wen-Bin Lin, Lee Donohue
  • Publication number: 20050287755
    Abstract: A method for fabricating a capacitor arrangement which includes at least three electrodes is described. The capacitor arrangement is fabricated using a number of lithography methods that is smaller than the number of electrodes. A capacitor arrangement extending over more than two or more interlayers between metallization layers has a high capacitance per unit area and can be fabricated in a simple way is also described. The circuit arrangement has a high capacitance per unit area and can be fabricated in a simple way. An electrode layer is first patterned using a dry-etching process and residues of the electrode layer are removed using a wet-chemical process, making it possible to fabricate capacitors with excellent electrical properties.
    Type: Application
    Filed: June 20, 2005
    Publication date: December 29, 2005
    Inventors: Jens Bachmann, Bernd Foste, Klaus Goller, Jakob Kriz
  • Publication number: 20050277300
    Abstract: A method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits includes the following steps: providing a substrate; providing a whisker-containing layer made of aluminum metal or an aluminum alloy on the substrate; back-etching and/or resputtering the whisker-containing layer such that the whiskers are essentially removed; and structuring the whisker-free layer into the lines.
    Type: Application
    Filed: June 15, 2004
    Publication date: December 15, 2005
    Inventors: Dirk Efferenn, Jens Hahn, Uwe Kahler, Chung-Hsin Lin, Jens Bachmann, Wen-Bin Lin, Grit Bonsdorf
  • Publication number: 20050181604
    Abstract: A method for structuring metal is disclosed. At least one corrosion-intensive metal layer is deposited on an Si substrate by means of deposition method. An etching mask is then produced on the corrosion-intensive metal layer by photolithographic patterning processes using a resist. The metal layer can then be patterned through the etching mask by means of etching, preferably by plasma etching.
    Type: Application
    Filed: January 6, 2005
    Publication date: August 18, 2005
    Inventors: Hans-Peter Sperlich, Lothar Brencher, Jens Bachmann
  • Patent number: 6869886
    Abstract: The present invention relates to a process for etching a metal layer system. The metal layer system includes a first aluminum-containing layer, a second aluminum-containing layer, and an interlayer arranged between the two aluminum-containing layers. The interlayer consists of a material that is suitable for end-point detection. The etching process includes a first etching step, in which the upper aluminum-containing layer is etched using a first etching angle, and a second etching step, in which the lower aluminum-containing layer is etched using a second etching angle. The process switches between the first etching step and the second etching step as soon as the end-point detection has detected that the interlayer has been reached. Accordingly, the interlayer is arranged at a location at which it is intended for the process to switch from the first etching step to the second etching step.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: March 22, 2005
    Assignee: Infineon Technologies AG
    Inventors: Jens Bachmann, Ulrich Baier, Falko Höhnsdorf
  • Publication number: 20050017328
    Abstract: The present invention provides a device having a useful structure which is arranged on a substrate and has a useful structure side edge. In addition, an auxiliary structure is arranged on the substrate adjacent to the useful structure, the auxiliary structure having an auxiliary structure side edge, wherein the useful structure side edge is opposite to the auxiliary structure side edge separated by a distance, and wherein the auxiliary structure useful structure distance is dimensioned such that a form of the useful structure side edge or a form of the substrate next to the useful structure side edge differs from a form in a device where there is no auxiliary structure.
    Type: Application
    Filed: June 10, 2004
    Publication date: January 27, 2005
    Applicant: Infineon Technologies AG
    Inventors: Jens Bachmann, Klaus Goller, Dirk Grueneberg, Reiner Schwab
  • Publication number: 20030068899
    Abstract: The present invention relates to a process for etching a metal layer system. The metal layer system includes a first aluminum-containing layer, a second aluminum-containing layer, and an interlayer arranged between the two aluminum-containing layers. The interlayer consists of a material that is suitable for end-point detection. The etching process includes a first etching step, in which the upper aluminum-containing layer is etched using a first etching angle, and a second etching step, in which the lower aluminum-containing layer is etched using a second etching angle. The process switches between the first etching step and the second etching step as soon as the end-point detection has detected that the interlayer has been reached. Accordingly, the interlayer is arranged at a location at which it is intended for the process to switch from the first etching step to the second etching step.
    Type: Application
    Filed: October 9, 2002
    Publication date: April 10, 2003
    Inventors: Jens Bachmann, Ulrich Baier, Falko Hohnsdorf