Patents by Inventor Jens Dennemarck
Jens Dennemarck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240150128Abstract: The invention relates to a method and a system for packaging articles (2). Outer packages (3) are set down on a horizontal conveying device (10, 20) and are transported along a packaging line. During the transport, articles are introduced via a manipulator into the outer packages (3), and the outer packages (3) with the introduced articles (2) are subsequently removed from the horizontal conveying device (10, 20) as a packaging unit (8). A predetermined packaging process (VP1) is carried out, in which the outer packages (3) are received by the horizontal conveying device (10, 20) via a plurality of shuttles (5), the outer packages (3) standing on said plurality of shuttles (5), until the outer packages (3) together with the introduced articles (2) are removed from the at least one horizontal conveying device (10, 20) as a packaging unit (8).Type: ApplicationFiled: December 22, 2021Publication date: May 9, 2024Inventors: Thomas STADLER, Philipp SCHARTNER, Peter DENNEMARCK, Martin DIETERSBERGER, Christian CANALICCHIO, Herbert SPINDLER, Jens LOSERT, Josef UNTERSEHER
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Patent number: 10411160Abstract: An optoelectronic component includes an active zone that generates electromagnetic radiation, wherein the electromagnetic radiation is guided in a guide plane, the electromagnetic radiation is output essentially in the guide plane, the active zone emits stray radiation laterally with respect to the guide plane, an electrical contact pad is provided, the contact pad is arranged outside the guide plane, the contact pad is formed by a surface at least partially covered by a conductive layer, the surface has inclined partial faces, and the electrically conductive layer on at least a subset of the inclined faces of the contact pad is configured to be so thin that electromagnetic stray radiation is emitted via the subset of the inclined faces.Type: GrantFiled: November 10, 2015Date of Patent: September 10, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Jens Mueller, Christine Höss, Jens Dennemarck, Johann Koller
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Patent number: 10224393Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.Type: GrantFiled: June 6, 2017Date of Patent: March 5, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Günther, Andreas Plöβl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Publication number: 20180287012Abstract: An optoelectronic component includes an active zone that generates electromagnetic radiation, wherein the electromagnetic radiation is guided in a guide plane, the electromagnetic radiation is output essentially in the guide plane, the active zone emits stray radiation laterally with respect to the guide plane, an electrical contact pad is provided, the contact pad is arranged outside the guide plane, the contact pad is formed by a surface at least partially covered by a conductive layer, the surface has inclined partial faces, and the electrically conductive layer on at least a subset of the inclined faces of the contact pad is configured to be so thin that electromagnetic stray radiation is emitted via the subset of the inclined faces.Type: ApplicationFiled: November 10, 2015Publication date: October 4, 2018Inventors: Jens Mueller, Christine Höss, Jens Dennemarck, Johann Koller
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Publication number: 20170345966Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.Type: ApplicationFiled: August 14, 2017Publication date: November 30, 2017Inventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
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Publication number: 20170271438Abstract: A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.Type: ApplicationFiled: June 6, 2017Publication date: September 21, 2017Inventors: Ewald Karl Michael Günther, Andreas Plössl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Patent number: 9768344Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.Type: GrantFiled: April 5, 2016Date of Patent: September 19, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
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Patent number: 9704945Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.Type: GrantFiled: February 7, 2012Date of Patent: July 11, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Günther, Andreas Plöβl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Publication number: 20160218241Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of removing the transmissive layer within the separating region before starting a separation process with help of a laser, applying an absorbent layer within the separating region, wherein the absorbent layer remains in the separation region during a subsequent separation process with help of a laser, and increasing the absorption coefficient of the transmissive layer within the separating region, and subsequently separating the chip regions along the separating regions by a laser.Type: ApplicationFiled: April 5, 2016Publication date: July 28, 2016Inventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
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Patent number: 9324615Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has, at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of: removing the transmissive layer within the separating region, applying an absorbent layer within the separating region, increasing the absorption coefficient of the transmissive layer within the separating region, and separating the chip regions along the separating regions by a laser.Type: GrantFiled: April 4, 2012Date of Patent: April 26, 2016Assignee: OSRAM Opto Semiconductors GmbHInventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kämpf, Jens Dennemarck
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Patent number: 9165816Abstract: A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.Type: GrantFiled: March 16, 2012Date of Patent: October 20, 2015Assignee: OSRAM Opto Semiconductors GmbHInventors: Heribert Zull, Korbinian Perzlmaier, Andreas Ploessl, Thomas Veit, Mathias Kaempf, Jens Dennemarck, Bernd Boehm
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Patent number: 8916403Abstract: A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface, wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor chips.Type: GrantFiled: February 3, 2011Date of Patent: December 23, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Ewald K. M. Günther, Mathias Kämpf, Jens Dennemarck, Nikolaus Gmeinwieser
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Publication number: 20140080286Abstract: A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has, at least within the separating region a transmissive layer transmissive to electromagnetic radiation, carrying out at least one of: removing the transmissive layer within the separating region, applying an absorbent layer within the separating region, increasing the absorption coefficient of the transmissive layer within the separating region, and separating the chip regions along the separating regions by a laser.Type: ApplicationFiled: April 4, 2012Publication date: March 20, 2014Applicant: Osram Opto Semiconductors GMBHInventors: Korbinian Perzlmaier, Heribert Zull, Franz Eberhard, Thomas Veit, Mathias Kampf, Jens Dennemarck
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Publication number: 20140080287Abstract: A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.Type: ApplicationFiled: March 16, 2012Publication date: March 20, 2014Applicant: OSRAM Opto Semiconductors GmbHInventors: Heribert Zull, Korbinian Perzlmaier, Andreas Ploessl, Thomas Veit, Mathias Kampf, Jens Dennemarck, Bernd Bohm
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Publication number: 20140008770Abstract: A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.Type: ApplicationFiled: February 7, 2012Publication date: January 9, 2014Applicant: OSRAM Opto Semiconductors GmbHInventors: Ewald Karl Michael Günther, Andreas Plößl, Heribert Zull, Thomas Veit, Mathias Kämpf, Jens Dennemarck, Bernd Böhm, Korbinian Perzlmaier
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Publication number: 20130069086Abstract: A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface. wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor.Type: ApplicationFiled: February 3, 2011Publication date: March 21, 2013Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Ewald K. M. Günther, Mathias Kämpf, Jens Dennemarck, Nikolaus Gmeinwieser