Patents by Inventor Jens Dirk Moschner
Jens Dirk Moschner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967657Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: April 6, 2020Date of Patent: April 23, 2024Assignee: Maxeon Solar Pte. Ltd.Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Publication number: 20220367738Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: June 9, 2022Publication date: November 17, 2022Inventors: Richard Hamilton Sewell, Robert Woehl, Jens Dirk Moschner, Nils-Peter Harder
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Patent number: 10923616Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: GrantFiled: March 9, 2020Date of Patent: February 16, 2021Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Publication number: 20210020794Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: April 6, 2020Publication date: January 21, 2021Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Publication number: 20200212248Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: ApplicationFiled: March 9, 2020Publication date: July 2, 2020Inventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Patent number: 10622505Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: GrantFiled: November 27, 2018Date of Patent: April 14, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Patent number: 10615296Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: August 30, 2018Date of Patent: April 7, 2020Assignees: SunPower Corporation, Total Marketing ServicesInventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Publication number: 20190097077Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: ApplicationFiled: November 27, 2018Publication date: March 28, 2019Inventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Publication number: 20190019900Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: August 30, 2018Publication date: January 17, 2019Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 10177270Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: GrantFiled: September 27, 2017Date of Patent: January 8, 2019Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Publication number: 20180286994Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: ApplicationFiled: April 2, 2018Publication date: October 4, 2018Inventors: RICHARD HAMILTON SEWELL, ROBERT WOEHL, JENS DIRK MOSCHNER, NILS-PETER HARDER
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Patent number: 10090421Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: April 12, 2017Date of Patent: October 2, 2018Assignees: SunPower Corporation, Total Marketing ServicesInventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 10032942Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.Type: GrantFiled: April 20, 2017Date of Patent: July 24, 2018Assignees: SunPower Corporation, Total Marketing ServicesInventors: Taeseok Kim, Robert Woehl, Gabriel Harley, Nils-Peter Harder, Jens-Dirk Moschner, Matthieu Moors, Michel Arsene Olivier Ngamo Toko
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Patent number: 9935213Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.Type: GrantFiled: June 26, 2015Date of Patent: April 3, 2018Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Robert Woehl, Jens Dirk Moschner, Nils-Peter Harder
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Publication number: 20180019364Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: ApplicationFiled: September 27, 2017Publication date: January 18, 2018Inventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
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Patent number: 9818903Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.Type: GrantFiled: April 30, 2014Date of Patent: November 14, 2017Assignees: SunPower Corporation, Total Marketing ServicesInventors: Richard Hamilton Sewell, Michel Arsène Olivier Nagamo Toko, Matthieu Moors, Jens Dirk Moschner
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Publication number: 20170222073Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.Type: ApplicationFiled: April 20, 2017Publication date: August 3, 2017Inventors: Taeseok Kim, Robert Woehl, Gabriel Harley, Nils-Peter Harder, Jens-Dirk Moschner, Matthieu Moors, Michel Arsene Olivier Ngamo Toko
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Publication number: 20170222068Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: ApplicationFiled: April 12, 2017Publication date: August 3, 2017Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
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Patent number: 9634178Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.Type: GrantFiled: December 16, 2015Date of Patent: April 25, 2017Assignees: SunPower Corporation, Total Marketing ServicesInventors: Taeseok Kim, Robert Woehl, Gabriel Harley, Nils-Peter Harder, Jens-Dirk Moschner, Matthieu Moors, Michel Arsène Olivier Ngamo Toko
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Patent number: 9627566Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.Type: GrantFiled: November 30, 2015Date of Patent: April 18, 2017Assignees: SunPower Corporation, Total Marketing ServicesInventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner