Abstract: A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

Abstract: A heat pipe device comprising at least two of the following: an axially grooved bore for thermal transport, the axially grooved bore having an axial groove wick; a phase change material bore for thermal storage, the phase change material bore having internal fins to enhance heat transfer, the internal fins extend along the axis of the phase change material bore; and a porous media bore for accepting high heat fluxes, the porous media bore having a porous media wick in areas of high heat flux.

Abstract: A heat pipe assembly that includes at least one axial groove heat pipe and at least one porous media heat pipe. The porous media heat pipe may be embedded into a flange of the axial groove heat pipe, or embedded into a wall of the axial groove heat pipe, or embedded into another bore of the axial groove heat pipe. The evaporator of the at least one porous media heat pipe may be located remotely and can accept a high heat flux, while a condenser of the at least one porous media heat pipe is attached to the axial groove heat pipe.

Abstract: A card retainer device for securing a card module in a channel of a chassis. The card retainer device includes wedge members which have main portions with integrated brackets integrally attached to the main portions, the integrated brackets form first L-shaped brackets which engage walls of the chassis, surfaces of the card module or a combination thereof. The L-shaped brackets provide bearing surfaces which reduces binding and wear when the card retainer device secures the card module in the channel of a chassis and enhances the conductance of heat through the card retainer device. The wedge members provide heat transfer paths between the card module and the chassis. Mating surfaces of mating wedge member interfaces have compound angles that produces an applied force orthogonal to a flange of the conduction card that is greater than the force applied parallel to the flange of the conduction card.

Abstract: A heat pipe assembly that includes at least one axial groove heat pipe and at least one porous media heat pipe. The porous media heat pipe may be embedded into a flange of the axial groove heat pipe, or embedded into a wall of the axial groove heat pipe, or embedded into another bore of the axial groove heat pipe. The evaporator of the at least one porous media heat pipe may be located remotely and can accept a high heat flux, while a condenser of the at least one porous media heat pipe is attached to the axial groove heat pipe.

Abstract: The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.