Abstract: A measurement method includes emitting a transmission signal comprising at least one light pulse, wherein an amplitude of an intensity of the light pulse is modulated with a modulation frequency, detecting a receiving signal comprising at least a part of the transmission signal that is reflected from an external object, selecting at least one frequency component of the receiving signal corresponding to the modulation frequency of the transmission signal, and determining a distance to the external object from a time difference between the emission of the transmission signal and the detection of the selected frequency component of the receiving signal.

Abstract: The invention relates to an edge emitting laser diode comprising a semiconductor layer stack whose growth direction defines a vertical direction, and wherein the semiconductor layer stack comprises an active layer and a waveguide layer. A thermal stress element is arranged in at least indirect contact with the semiconductor layer stack, the thermal stress element being configured to generate a thermally induced mechanical stress in the waveguide layer that counteracts the formation of a thermal lens.

Abstract: In an embodiment a method includes providing at least one component attached to a first carrier via a support holder, positioning a light-conducting lifting element with a light emitting surface opposite the transfer area, generating a first laser light pulse through the light emitting surface, locally melting a transfer material between the light emitting surface and the transfer area caused by the first laser light pulse, connecting the light emitting surface to the transfer area with the melted transfer material, lifting the at least one component so as to separate the component from the support holder, positioning the at least one component above a deposition area, generating a second laser light pulse through the light emitting surface so that the transfer material is melted again and moving the lifting element away from the transfer area before the transfer material solidifies and so that the component remains on the deposition area.

Abstract: An optical sensor arrangement, for example for a LiDAR system, includes an emitter unit and a receiver unit. The emitter unit includes a semiconductor laser configured to emit coherent electromagnetic radiation having at least two wavelengths. Furthermore, the emitter unit is configured to direct the emitted electromagnetic radiation at a remote target, the receiver unit including at least one optical sensor configured to selectively detect electromagnetic radiation depending on the at least two wavelengths. The receiver unit is arranged relative to the emitter unit and configured such that electromagnetic radiation scattered or reflected by the remote target is detectable on the optical sensor.

Abstract: In an embodiment an optoelectronic device includes a layer stack having a circumferential sidewall region and having an n-doped layer, an active region layer deposited on the n-doped layer, the active region layer having a central first portion and a surrounding second portion, a p-doped layer arranged on the active region layer, wherein the surrounding second portion comprises a p-type dopant causing a quantum well intermixing in the surrounding second portion and a thin n-doped surface layer on the circumferential sidewall extending from the n-doped layer substantially towards a top of the p-doped layer thereby forming an artificial pn-junction substantially parallel to the circumferential sidewall region and at least partially within the surrounding second portion and the p-doped layer.

Abstract: In an embodiment an optoelectronic arrangement includes an optoelectronic component having a layer stack including an active area arranged between a layer of a first conductive type and a layer of a second conductive type, a substrate configured to generate an alternating electrical field at a surface of the substrate, the alternating electrical field having opposing field components and at least one first excitation element arranged on or within the substrate, wherein the optoelectronic component is arranged on the substrate such that the opposing field components of the alternating electrical field are substantially perpendicular to respective layers of the layer stack.

Abstract: In an embodiment a method for producing an optoelectronic semiconductor component includes A) providing a semiconductor body comprising, sequentially in a vertical direction, a first layer of a first conductivity type, an active layer formed as a quantum well structure provided for emission of electromagnetic radiation, and a second layer of a second conductivity type and B) irradiating the semiconductor body with a focused electromagnetic radiation such that a focus region of the electromagnetic radiation lies within the active layer and overlaps with the quantum well structure, wherein the electromagnetic radiation has an intensity which is sufficiently large in the focus region to cause point defects in the quantum well structure so that a defect region is formed and so that a generation of the point defects is limited to the focus region, and wherein a density of point defects in the first layer and the second layer is not changed in B).

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip, component, including the following steps: —providing an epitaxial semiconductor layer sequence with an active zone, which is configured to generate electromagnetic radiation during operation, —structuring the epitaxial semiconductor layer sequence so that at least one lateral surface is produced in the epitaxial semiconductor layer sequence, —introducing aluminum atoms at the lateral surface into the epitaxial semiconductor layer sequence, so that a band gap of the active zone at the lateral surface is increased. The invention also relates to an optoelectronic semiconductor chip.

Abstract: In an embodiment, the gain-guided semiconductor laser includes a semiconductor layer sequence and electrical contact pads. The semiconductor layer sequence includes an active zone for radiation generation, a waveguide layer, and a cladding layer. The semiconductor layer sequence further includes a current diaphragm layer which is electrically conductive along a resonator axis (R) in a central region and electrically insulating in adjoining edge regions. Transverse to the resonator axis (R), the central region includes a width of at least 10 ?m and the edge regions includes at least a minimum width. The minimum width is 3 ?m or more. Seen in plan view, the semiconductor layer sequence as well as at least one of the contact pads on the semiconductor layer sequence are continuous components extending in the central region as well as on both sides at least up to the minimum width in the direction transverse to the resonator axis (R) adjoining the central region and beyond the central region.

Abstract: In an embodiment a method for producing an optoelectronic semiconductor component includes A) providing a semiconductor body comprising, sequentially in a vertical direction, a first layer of a first conductivity type, an active layer formed as a quantum well structure provided for emission of electromagnetic radiation, and a second layer of a second conductivity type and B) irradiating the semiconductor body with a focused electromagnetic radiation such that a focus region of the electromagnetic radiation lies within the active layer and overlaps with the quantum well structure, wherein the electromagnetic radiation has an intensity which is sufficiently large in the focus region to cause point defects in the quantum well structure so that a defect region is formed and so that a generation of the point defects is limited to the focus region, and wherein a density of point defects in the first layer and the second layer is not changed in B).

Abstract: In at least one embodiment, the environment sensor for sensing at least one environment parameter includes a semiconductor layer sequence, a sheath, the index of refraction of which changes as a function of the environment parameter, and a first electrical contact and a second electrical contact for supplying current to the semiconductor layer sequence. The semiconductor layer sequence has the shape of a generalized cylinder having a main axis. In directions perpendicular to the main axis, the semiconductor layer sequence is at least partly covered by the sheath. The semiconductor layer sequence has an index of refraction which is greater than the index of refraction of the sheath. The semiconductor layer sequence is designed to form laser modes within the environment sensor.

Abstract: In an embodiment a radiation emitting semiconductor body includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and an active region located between the first semiconductor region and the second semiconductor region, wherein the active region comprises InGaAlP, wherein the first conductivity type is n-conductive and the second conductivity type is p-conductive, wherein the active region has a larger band gap in an edge region of the semiconductor body than in a central region of the semiconductor body, and wherein a band gap of the second semiconductor region in the edge region and in the central region is the same.

Abstract: The semiconductor laser diode includes a semiconductor layer sequence having an active zone. The semiconductor layer sequence has a shape of a generalized cylinder or a frustum, and a main axis of the semiconductor layer sequence is perpendicular to a main extension plane of the semiconductor layer sequence. The semiconductor layer sequence has a core region and an edge region directly adjacent to the core region. The main axis passes through the core region. The edge region borders the core region in directions perpendicular to the main axis. The semiconductor layer sequence has a larger refractive index in the core region than in the edge region.

Abstract: An optoelectronic component (10) is specified, comprising a semiconductor body (6) with an active region (4) suitable for emission of radiation and comprising a quantum well structure, wherein the quantum well structure comprises at least one quantum well layer (41) and barrier layers (42), a first electrical contact (1) and a second electrical contact (2), wherein the active region (4) comprises at least one intermixed region (44) and at least one non-intermixed region (43). The at least one quantum well layer (41) and the barrier layers (42) are at least partially intermixed in the intermixed region (44), such that the intermixed region (44) comprises a larger electronic bandgap than the at least one quantum well layer (41) in the non-intermixed region (43). The first electrical contact (1) is a metal contact arranged on a radiation exit surface of the semiconductor body (6), wherein the intermixed region (44) is arranged below the first contact (1) in the vertical direction.

Abstract: In an embodiment a method for manufacturing a semiconductor device include providing a growth substrate, depositing an n-doped first layer, depositing an active region on the n-doped first layer, depositing a second layer onto the active region, depositing magnesium (Mg) in the second layer and subsequently to depositing Mg, depositing zinc (Zn) in the second layer such that a concentration of Zn in the second layer decreases from a first value to a second value in a first area of the second layer adjacent to the active region, the first area being in a range of 5 nm to 200 nm.

Abstract: Embodiments provide a method for treating a semiconductor wafer comprising a set of aluminum gallium indium phosphide light emitting diodes (AlGaInP-LEDs) to increase a light generating efficiency of the AlGaInP-LEDs, wherein each AlGaInP-LED includes a core active layer for light generation sandwiched between two outer layers, the core active layer having a central light generating area and a peripheral edge surrounding the central light generating area, wherein the method includes treating the peripheral edge of the core active layer of each AlGaInP-LED with a laser beam thereby increasing a minimum band gap in each peripheral edge to such an extent that, during operation of the AlGaInP-LED, an electron-hole recombination is essentially confined to the central light generating area.

Abstract: The invention relates to an edge emitting laser diode comprising a semiconductor layer stack whose growth direction defines a vertical direction, and wherein the semiconductor layer stack comprises an active layer and a waveguide layer. A thermal stress element is arranged in at least indirect contact with the semiconductor layer stack, the thermal stress element being configured to generate a thermally induced mechanical stress in the waveguide layer that counteracts the formation of a thermal lens.

Abstract: In an embodiment, an edge-emitting semiconductor laser diode includes a growth substrate, a semiconductor layer sequence located on the growth substrate, the semiconductor layer sequence having an active layer and an etch stop layer and two facets located opposite each other, wherein the facets bound the semiconductor layer sequence in a lateral direction, wherein the semiconductor layer sequence includes two edge regions adjoining the facets and a central region directly adjoining both edge regions, wherein, within each of the edge regions, a volume fraction of the active layer in the semiconductor layer sequence is smaller than in the central region, wherein the active layer is spaced apart from one facet, wherein a distance of the active layer to the facet varies along a direction parallel to this facet, and wherein the etch stop layer is arranged between the growth substrate and the active layer.

Abstract: An optoelectronic semiconductor element may emit electromagnetic radiation. The optoelectronic semiconductor element may include a semiconductor body and a reflective lattice structure directly adjacent to a first main surface of the semiconductor body. The reflective lattice structure may be made of layer portions periodically arranged in the horizontal direction. The first main surface may be different from an exit surface of the electromagnetic radiation.

Abstract: In an embodiment, the gain-guided semiconductor laser includes a semiconductor layer sequence and electrical contact pads. The semiconductor layer sequence includes an active zone for radiation generation, a waveguide layer, and a cladding layer. The semiconductor layer sequence further includes a current diaphragm layer which is electrically conductive along a resonator axis (R) in a central region and electrically insulating in adjoining edge regions. Transverse to the resonator axis (R), the central region includes a width of at least 10 ?m and the edge regions includes at least a minimum width. The minimum width is 3 ?m or more. Seen in plan view, the semiconductor layer sequence as well as at least one of the contact pads on the semiconductor layer sequence are continuous components extending in the central region as well as on both sides at least up to the minimum width in the direction transverse to the resonator axis adjoining the central region and beyond the central region.