Abstract: A technique relates to a circuit. At least one 4 transistor (4T) static random access memory (SRAM) bitcell is included. Each of the 4T SRAM bitcells includes a first PFET, a first NFET, a second PFET, and a second NFET, the first PFET and the first NFET being coupled to form a first output node, and the second PFET and the second NFET being coupled to form a second output node. A pulldown circuit is coupled to the first NFET, the pulldown circuit operable to pull down a voltage at the first output node. A feedback circuit is operable to monitor the first output node, the feedback circuit operable to control the pulldown circuit.

Abstract: Ultra dense and stable 4T SRAM designs are provided. In one aspect, a 4T SRAM bitcell includes: two NFETs cross-coupled with two PFETs, wherein the NFETs are both connected directly to a word line, wherein a first one of the PFETs is connected to a first bit line via a first one of the NFETs and a second one of the PFETs is connected to a second bit line via a second one of the NFETs, and wherein the PFETs are each separately connected to ground. An SRAM device including the present 4T SRAM bitcell as well as a method of operating the SRAM device are also provided.

Abstract: Ultra dense and stable 4T SRAM designs are provided. In one aspect, a 4T SRAM bitcell includes: two NFETs cross-coupled with two PFETs, wherein the NFETs are both connected directly to a word line, wherein a first one of the PFETs is connected to a first bit line via a first one of the NFETs and a second one of the PFETs is connected to a second bit line via a second one of the NFETs, and wherein the PFETs are each separately connected to ground. An SRAM device including the present 4T SRAM bitcell as well as a method of operating the SRAM device are also provided.

Abstract: A method and apparatus for testing semiconductor wafers in which certain contact areas of dies not used in the testing and required to be at a predetermined voltage during testing are connected to the predetermined voltage via an integrated circuit in the die.

Abstract: For one or more disclosed methods, a supply voltage is supplied to an integrated circuit, the integrated circuit is placed in a test mode to select one of a plurality of reference voltage generators on the integrated circuit to supply to another voltage generator on the integrated circuit a reference voltage that is at least partially dependent on the supply voltage, and the integrated circuit is tested with the reference voltage supplied to the other voltage generator.

Abstract: For one or more disclosed embodiments, a test data topology may be written to memory by writing data into an initial row of memory cells. The writing of data comprises latching data in a plurality of sense amplifier latches. The initial row of memory cells is deactivated while the latched data is retained in the sense amplifier latches. Another row of memory cells is identified in accordance with a predetermined row addressing sequence for the test data topology. The other row of memory cells is activated to write the retained latched data to the other row.

Abstract: A method and apparatus for testing semiconductor wafers in which certain contact areas of dies not used in the testing and required to be at a predetermined voltage during testing are connected to the predetermined voltage via an integrated circuit in the die.

Abstract: For one or more disclosed embodiments, a test data topology may be written to memory by writing data into an initial row of memory cells. The writing of data comprises latching data in a plurality of sense amplifier latches. The initial row of memory cells is deactivated while the latched data is retained in the sense amplifier latches. Another row of memory cells is identified in accordance with a predetermined row addressing sequence for the test data topology. The other row of memory cells is activated to write the retained latched data to the other row.

Abstract: For one or more disclosed methods, a supply voltage is supplied to an integrated circuit, the integrated circuit is placed in a test mode to select one of a plurality of reference voltage generators on the integrated circuit to supply to another voltage generator on the integrated circuit a reference voltage that is at least partially dependent on the supply voltage, and the integrated circuit is tested with the reference voltage supplied to the other voltage generator.