Patents by Inventor Jens Hockel

Jens Hockel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular lighting system and lighting arrangement
    Publication number: 20080036397
    Abstract: A modular lighting system having a plurality of light modules, which each have a plurality of light modules accommodating at least one light-emitting diode module. The light modules have at least two mounting clearances, which run substantially parallel, and a mounting rod passes through each mounting clearance for mechanical fixing and electrical contact-making purposes. The mounting clearances are formed on the luminaire body. A lighting arrangement of such lighting systems is also disclosed.
    Type: Application
    Filed: April 23, 2007
    Publication date: February 14, 2008
    Applicants: Patent-Treuhand-Gesellschaft fur elektrische Gluhlampen mbH, STG-Beikirch Industrieelektronik + Sichercheitstechnik GmbH & Co. KG
    Inventors: Jens Hockel, Ralf Boing, Stephan Lukanow, Birgit Wels
  • TEMPERATURE AND LIGHTING CONTROL DEVICE
    Publication number: 20070263386
    Abstract: The present invention relates to a device for controlling room temperature and room lighting wherein the device comprises a temperature control system for the receipt and/or delivery of heat to the surroundings and a lighting system wherein the lighting system is thermally coupled to sections of the temperature control system.
    Type: Application
    Filed: May 14, 2007
    Publication date: November 15, 2007
    Inventors: Jens Hockel, Harald Stoyan
  • Printed circuit board and method for producing such a printed circuit board
    Publication number: 20060023432
    Abstract: A printed circuit board having a thermally conductive and electrically insulating layer (1) at the top side of the printed circuit board (6), and a heat conducting element (2) which thermally connects the layer (1) to the underside of the printed circuit board (6). Furthermore, a method for producing such a printed circuit board (6) is described.
    Type: Application
    Filed: July 28, 2005
    Publication date: February 2, 2006
    Applicant: Patent-Treuhand-Gesellschaft fur elektrische Gluhlampen mbH
    Inventors: Jens Hockel, Patrick Muller