Abstract: A laser-machining device comprising a laser-radiation source to generate a laser beam and emit it along an optical path; a beam-splitting unit downstream of the laser-radiation source designed to split the laser beam into a bundle of partial beams; an optical control unit downstream of the beam-splitting unit comprising a reflective optical functional unit formed by an array of reflective microscanners, wherein the optical control unit is designed to select any desired number of partial beams in any desired spatial combination from the bundle of partial beams and direct them onto a workpiece, and to position and/or move at least one of those partial beams within a specified partial-beam scanning region of the respective partial beam using the microscanner of the array of microscanners assigned to the respective partial beam, and methods for laser machining a workpiece.

Abstract: A laser processing apparatus includes: a laser generator that generates a laser beam, a diffractive optical element that divides the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam gap adjustor that adjusts a gap between neighboring ones of the plurality of sub-laser beams. Therefore, by installing a diffractive optical element that divides a laser beam that is generated by the laser generator into the plurality of sub-laser beams and a beam gap adjustor to adjust a gap between a plurality of sub-laser beams, the laser processing apparatus can form a processing pattern of various resolutions in a shadow mask while improving a processing speed of the shadow mask.

Abstract: A laser processing apparatus includes a laser generator for generating laser beams, a diffraction optic element for dividing the laser beam generated by the laser generator into a plurality of sub-laser beams, and a beam number controller for controlling the number of the plurality of sub-laser beams. Accordingly, the diffractive optic element that splits a laser beam generated by the laser beam generator into a plurality of sub-laser beams and the beam number controller that controls the number of sub-laser beams are provided so that the processing speed of a processing target can be improved and, at the same time, the number of laser beams can be promptly controlled, thereby promptly forming various patterns of the processing target.