Abstract: A wet multi-plate clutch includes a plate carrier with a pair of fluid passage openings and a friction plate rotationally fixed and axially displaceable relative to the plate carrier. The friction plate has a carrier element and a pair friction pads fastened to the carrier element and delimiting a groove. The groove includes a groove geometrical center line. The groove geometrical center line may extend radially through a one of the pair of fluid passage openings, or it may extend radially between the pair of fluid passage openings. If the groove geometrical center line extend radially between the pair of fluid passage openings, one of the pair of friction pads may include a pad geometrical center line extending along a radial extent through a one of the pair of fluid passage openings.

Abstract: An apparatus for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool including a polish pad and a pad resurfacing arm which includes a pad cleaning part, a pad conditioning part, and a slurry dispensing part, dispensing a slurry to the polish pad utilizing the pad resurfacing arm, and polishing the semiconductor wafer utilizing the polish pad.

Abstract: Wafer processing apparatuses and methods of operating the same are provided herein. In an embodiment, a wafer processing apparatus includes a rotatable platen that has the capacity to support a polishing pad on a pad mounting surface of the rotatable platen. A drive assembly is coupled to the rotatable platen and has the capacity to rotate the rotatable platen. A polishing head is coupled to a head actuator. The polishing head is disposed adjacent to and over a first portion of the pad mounting surface and the polishing head is movable relative to the pad mounting surface by the head actuator. An optical sensor has a vision field including a second portion of the pad mounting surface. The first portion and the second portion of the pad mounting surface are at least partially offset. A control unit is operatively connected to the drive assembly and the head actuator.

Abstract: Wafer processing apparatuses and methods of operating the same are provided herein. In an embodiment, a wafer processing apparatus includes a rotatable platen that has the capacity to support a polishing pad on a pad mounting surface of the rotatable platen. A drive assembly is coupled to the rotatable platen and has the capacity to rotate the rotatable platen. A polishing head is coupled to a head actuator. The polishing head is disposed adjacent to and over a first portion of the pad mounting surface and the polishing head is movable relative to the pad mounting surface by the head actuator. An optical sensor has a vision field including a second portion of the pad mounting surface. The first portion and the second portion of the pad mounting surface are at least partially offset. A control unit is operatively connected to the drive assembly and the head actuator.

Abstract: An apparatus for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool including a polish pad and a pad resurfacing arm which includes a pad cleaning part, a pad conditioning part, and a slurry dispensing part, dispensing a slurry to the polish pad utilizing the pad resurfacing arm, and polishing the semiconductor wafer utilizing the polish pad.

Abstract: Methods for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool including a polish pad and a pad resurfacing arm which includes a pad cleaning part, a pad conditioning part, and a slurry dispensing part, dispensing a slurry to the polish pad utilizing the pad resurfacing arm, and polishing the semiconductor wafer utilizing the polish pad.

Abstract: Methods for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a semiconductor wafer on a chemical mechanical polishing (CMP) tool, the CMP tool including a polish pad and a pad resurfacing arm which includes a pad cleaning part, a pad conditioning part, and a slurry dispensing part, dispensing a slurry to the polish pad utilizing the pad resurfacing arm, and polishing the semiconductor wafer utilizing the polish pad.

Abstract: A method for centrifugal reprocessing of a solids-containing emulsion formed during the hydrometallurgical recovery of a metal involves performing the reprocessing in at least one decanter to form a first lighter liquid phase, a second liquid phase, and a solids phase. An actual value of the density of the first liquid phase is determined, the actual value is compared with a desired value for the density of the first liquid phase, and the outlet pressure of the first liquid phase is set in dependence upon the determined actual value/desired value comparison.

Abstract: In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system.

Abstract: In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system.

Abstract: In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the conditions of consumables, thereby enhancing process stability.

Abstract: In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system.

Abstract: In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to control a CMP system to compensate for a change in the conditions of consumables, thereby enhancing process stability.

Abstract: In a system and a method according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system.

Abstract: A retaining member for a polishing head in a CMP apparatus comprises a bottom surface with silicon carbide. Due to the superior characteristics of silicon carbide, a low wear rate of the retaining member is secured, wherein, additionally, accumulation of electrostatic charges is substantially avoided due to the conductivity of silicon carbide. Consequently, cost of ownership is reduced, while at the same time process stability over a large number of substrates is increased.

Abstract: An electrodynamic drive system (2) for a vehicle between a drive engine (4) and a manual transmission (16) comprising a planetary transmission (12) with the three elements sun gear (50), internal gear (10) and planet carrier (32), of which a first element (32) is connected to the manual transmission (16), a second element (10) is connected to the drive engine (4), and a third element (50) is connected to at least one electrical engine (22). A clutch (40) is provided with a first shift position, in which a rigid connection exists between the planet carrier (32) and the sun gear (50) for bridging the planetary transmission (12), and a second shift position in which the connection between the planet carrier (32) and the sun gear (50) is interrupted.

Abstract: An electrodynamic drive system (2) for a vehicle between a drive engine (4) and a manual transmission (16) comprising a planetary transmission (12) with the three elements sun gear (50), internal gear (10) and planet carrier (32), of which a first element (32) is connected to the manual transmission (16), a second element (10) is connected to the drive engine (4), and a third element (50) is connected to at least one electrical engine (22). A clutch (40) is provided with a first shift position, in which a rigid connection-exists between the planet carrier (32) and the sun gear (50) for bridging the planetary transmission (12), and a second shift position in which the connection between the planet carrier (32) and the sun gear (50) is interrupted.