Abstract: A system for a projection exposure apparatus which comprises a first component, a second component, and a decoupling device configured to decouple the second component in more than one degree of freedom from mechanical excitations of the first component. The decoupling device comprises first decoupling elements which have a positive stiffness. The decoupling device also comprises second decoupling elements, which have a negative stiffness. The decoupling device further comprises a third component, which is arranged between the first and second components.

Abstract: An optical element comprises a substrate and an optical surface formed on the substrate. At least one fluid-tight sealed chamber is embedded in the substrate and has a rheological fluid introduced therein for deforming the optical surface. An optical arrangement, such as an EUV lithography system, comprises at least one optical element as described above and a field generating device for generating an electromagnetic field. The electromagnetic field can be a time-varying electromagnetic field. The electromagnetic field can be a magnetic field. The electromagnetic field passes through the at least one chamber which contains the rheological fluid. A method for producing an optical element designed as described above is also provided.

Abstract: The disclosure relates to a damping arrangement for vibration damping of an element in an optical system, for example in a microlithographic projection exposure apparatus. A damping arrangement according to the disclosure has an element, a fluid located in a cavity, and at least one channel connected to the cavity. A vibration of the element causes vibration energy of the element to be dissipated by partial displacement of the fluid from the cavity into the at least one channel.

Abstract: A method for maintaining a projection exposure apparatus comprising at least two modules and a reference element, wherein the modules are referenced to the reference element, comprises: removing a module; attaching a service module to or in the vicinity of the projection exposure apparatus; referencing the service module to the reference element of the projection exposure apparatus; and implementing a maintenance measure with the aid of the service module.

Abstract: An arrangement for use in a microlithographic optical imaging device includes an optical unit and a supporting structure for supporting the optical unit. The optical unit includes an optical element, a carrier structure for carrying the optical element, and an active actuating device. The optical element is supported on the carrier structure via of the active actuating device. The active actuating device is configured to adjust the optical element during normal operation of the optical imaging device in a maximum movement range, which is predefined by the normal operation of the optical imaging device, with respect to a first reference assigned to the imaging device. The active actuating device is configured so that the maximum movement range is completely covered by actuating movements of the active actuating device with an actuating accuracy predefined by the normal operation of the optical imaging device.

Abstract: An optical arrangement for use in an optical imaging device includes an optical element unit and a detection device and/or an actuating device. The optical element unit includes at least one optical element. The detection device determines in a plurality of M degrees of freedom in each case a detection value which is representative of a relative position or orientation of an element reference of the optical element in relation to a primary reference of the detection device in the respective degree of freedom. The detection device includes a plurality of N detection units, each of which outputs a detection signal which is representative of a distance and/or a displacement of the detection unit in relation to a secondary reference assigned to the optical element and the respective detection unit.

Abstract: A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

Abstract: An optical arrangement for use in an optical imaging device includes an optical element unit and a detection device and/or an actuating device. The optical element unit includes at least one optical element. The detection device determines in a plurality of M degrees of freedom in each case a detection value which is representative of a relative position or orientation of an element reference of the optical element in relation to a primary reference of the detection device in the respective degree of freedom. The detection device includes a plurality of N detection units, each of which outputs a detection signal which is representative of a distance and/or a displacement of the detection unit in relation to a secondary reference assigned to the optical element and the respective detection unit.

Abstract: A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

Abstract: An optical imaging arrangement includes an optical projection system, a support structure system and a control device. The optical projection system includes a group of optical elements supported by the support structure system and configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask onto a substrate. The group of optical elements includes a first optical element and a second optical element and the control device includes a sensor device and an active device. The sensor device is functionally associated to the first optical element and is configured to capture mechanical disturbance information representative of a mechanical disturbance acting on the first optical element in at least one degree of freedom up to all six degrees of freedom.

Abstract: An imaging optical system, in particular a projection objective, for microlithography, includes optical elements to guide electromagnetic radiation with a wavelength in a path to image an object field into an image plane. The imaging optical system includes a pupil, having coordinates (p, q), which, together with the image field, having coordinates (x, y) of the optical system, spans an extended 4-dimensional pupil space, having coordinates (x, y, p, q), as a function of which a wavefront W(x, y, p, q) of the radiation passing through the optical system is defined. The wavefront W can therefore be defined in the pupil plane as a function of an extended 4-dimensional pupil space spanned by the image field (x, y) and the pupil (p, q) as W(x, y, p, q)=W(t), with t=(x, y, p, q).

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: An optical imaging arrangement includes an optical element unit, and an actuator device connected to the optical element unit and is configured to be connected to a support structure for supporting the optical unit. The actuator device is configured to: actively adjust, in an adjustment state, a position and/or an orientation of the optical unit with respect to the support structure in N degrees of freedom; and support the optical element unit in a statically overdetermined manner in at least one of the N degrees of freedom via a plurality of active first and second actuator components such that, in a holding state following the adjustment state, the first and second actuator components cause a parasitic residual load introduced into the optical element unit in the at least one of the N degrees of freedom.

Abstract: A projection exposure apparatus for semiconductor lithography includes at least one component, and a support device with at least one support actuator which acts on at least one support location of the component so that deformations of the component are reduced. The support device includes a control unit for triggering the at least one support actuator. The control unit is configured to trigger the support actuator in the event of a dynamic acceleration acting on the component. The disclosure also relates to a method for reducing deformations, resulting from dynamic accelerations, of a projection exposure apparatus for semiconductor lithography.

Abstract: A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Abstract: An optical imaging arrangement includes an optical element unit, and an actuator device connected to the optical element unit and is configured to be connected to a support structure for supporting the optical unit. The actuator device is configured to: actively adjust, in an adjustment state, a position and/or an orientation of the optical unit with respect to the support structure in N degrees of freedom; and support the optical element unit in a statically overdetermined manner in at least one of the N degrees of freedom via a plurality of active first and second actuator components such that, in a holding state following the adjustment state, the first and second actuator components cause a parasitic residual load introduced into the optical element unit in the at least one of the N degrees of freedom.

Abstract: An optical element module includes an optical element unit and a support structure. The optical element module includes an optical element. The support structure includes a support device and a contact device connected to the support device. A surface of the contact device contacts a surface of the optical element unit and exerts a holding force on the optical element unit along a holding force direction.

Abstract: An optical element unit including a first optical element module and a sealing arrangement is disclosed. The first optical element module occupies a first module space and includes a first module component of a first component type and an associated second module component of a second component type. The first component type is optical elements and the second component type being different from the first component type. The sealing arrangement separates the first module space into a first space and a second space and substantially prevents, at least in a first direction, the intrusion of substances from one of the first space and the second space into the other one of the first space and the second space. The first module component at least partially contacts the first space and, at least in its area optically used, not contacting the second space. The second module component at least partially contacts the second space.

Abstract: An optical module includes: a first holding device with a circumference extending in a first circumferential direction; and a plurality of first supporting devices configured to support a first optical element, the first supporting devices being fixed at the circumference of the first holding device. Along the first circumferential direction, at least one of the first supporting devices is located in a non-equidistant manner between two neighboring first supporting devices. The optical module is configured to be used in a microlithography objective.

Abstract: Disclosed is an optical module for a lens, especially a microlithographic apparatus, comprising a first holding device (2) with an inner circumference (2.1) that extends in a first circumferential direction (2.2), and at least one first supporting device (3.1) which is fastened to the inner circumference (2.1) of said first holding device (2) and is used for supporting a first optical element (5.1), an annular circumferential first assembly space (3.18) being defined by displacing the first supporting device (3.1) once in a revolving manner along the first circumferential direction (2.2). At least one second supporting device (3.2) which is fixed to the inner circumference (2.1) of the first holding device (2) is provided for supporting a second optical element (5.2), an annular circumferential second assembly space (3.28) being defined by displacing the second supporting device (3.2) once in a revolving manner along the first circumferential direction (2.2). The first assembly space (3.