Abstract: The invention relates to a method for marking wafers, in particular wafers for solar cell production: The method comprises the steps of manufacturing a position line (21a, 21b, 21c) on a peripheral surface of a silicon ingot or column, the ingot or column extending in an axial direction and having a longitudinal axis in the axial direction, wherein the position line extends in the axial direction along substantially the whole ingot or column and is inclined with respect to the longitudinal axis. By this position line it is possible to determine the position of a wafer cut from the ingot or column within the ingot or column, respectively. Further, an individual identification pattern (20a, 20b, 20c) of lines on the peripheral surface of the silicon ingot or column is manufactured, the individual identification pattern of lines extending in axial direction over substantially the whole ingot or column and providing an individual coding which allows to identify the silicon ingot or column.

Abstract: The invention relates to a method for the conditioning of flat objects such as silicon substrates. The objects, obtained by sawing from a block form a comb like structure by being fixed with one edge to a plate shaped fixation apparatus, are conditioned by conventional rinsing, separating and wet chemical treatment, wherein the treatment takes place before the separation of the sawed substrates from the fixation apparatus. An apparatus which is suitable for carrying out the method has two regions arranged parallel to the apparatus longitudinal axis (L) and above one another, wherein the upper region is configured as an adapter region (1). The lower region is formed as a holding region (2) which comprises a part, provided as a channel (11), of a circumferentially closed or closable channel system which can be supplied with liquid by means of closable supply openings (5).

Abstract: The invention relates to a method for marking wafers, in particular wafers for solar cell production: The method comprises the steps of manufacturing a position line (21a, 21b, 21c) on a peripheral surface of a silicon ingot or column, the ingot or column extending in an axial direction and having a longitudinal axis in the axial direction, wherein the position line extends in the axial direction along substantially the whole ingot or column and is inclined with respect to the longitudinal axis. By this position line it is possible to determine the position of a wafer cut from the ingot or column within the ingot or column, respectively. Further, an individual identification pattern (20a, 20b, 20c) of lines on the peripheral surface of the silicon ingot or column is manufactured, the individual identification pattern of lines extending in axial direction over substantially the whole ingot or column and providing an individual coding which allows to identify the silicon ingot or column.