Patents by Inventor Jens Moeckel

Jens Moeckel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Configuration of fuses in semiconductor structures with Cu metallization
    Patent number: 6774456
    Abstract: A configuration of fuses in a semiconductor structure having Cu metallization planes is provided. The semiconductor structure has an Al metal layer on the topmost interconnect plane for providing Al bonding pads. The fuses are configured as Al fuses and, in the semiconductor structure having Cu metallization planes, are provided above the diffusion barrier of the topmost Cu metallization plane but below a passivation layer.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: August 10, 2004
    Assignee: Infineon Technologies AG
    Inventors: Andreas Rusch, Jens Moeckel
  • Configuration of fuses in semiconductor structures with Cu metallization
    Publication number: 20020100957
    Abstract: A configuration of fuses in a semiconductor structure having Cu metallization planes is provided. The semiconductor structure has an Al metal layer on the topmost interconnect plane for providing Al bonding pads. The fuses are configured as Al fuses and, in the semiconductor structure having Cu metallization planes, are provided above the diffusion barrier of the topmost Cu metallization plane but below a passivation layer.
    Type: Application
    Filed: December 10, 2001
    Publication date: August 1, 2002
    Inventors: Andreas Rusch, Jens Moeckel