Abstract: The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.

Abstract: The invention relates to a holding device for holding substrates such as printed circuit boards, metal sheets, foils or the like, comprising a suction surface, the suction surface having a plurality of suction nozzles and the suction nozzles being subjected to a negative pressure relative to the ambient pressure by means of a device providing negative pressure for providing a holding force for one or more substrates, wherein the device providing negative pressure provides negative pressure, such that the ratio of the cumulated drop in pressure of all suction nozzles to the cumulated drop in pressure of all suction nozzles and supply lines of the suction nozzles up to the device providing negative pressure is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, in particular greater than 35%, preferably greater than 40%.

Abstract: The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.