Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.

Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.

Abstract: One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.

Abstract: The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 ?m. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

Abstract: The invention relates to a method for connecting components, comprising the following steps: (I) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) drying the metal paste applied to the contact surface of the first and optionally also to the contact surface of the second component; (4) producing a sandwich arrangement with the two components and the dried metal paste in-between; and (5) pressure sintering the sandwich arrangement comprising the layer of dried metal paste. The invention is characterised in that the drying is performed by irradiating with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm.

Abstract: The invention relates to a method for connecting components, comprising the following steps: (1) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) producing a sandwich arrangement with the two components and a layer of the metal paste in-between; (4) drying the layer of metal paste between the components; and (5) pressureless sintering of the sandwich arrangement comprising the layer of dried metal paste, the drying and the pressureless sintering being performed by irradiation with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm. The components can be selected from the group consisting of substrates, active components and passive components. One or both of the components can be permeable to IR radiation.

Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Abstract: One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.

Abstract: A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm?1.

Abstract: A metal paste contains (A) 75% to 90% by weight of at least one metal that is present in the form of particles comprising a coating that contains, at least one organic compound, (B) 0% to 12% by weight of at least one metal precursor, (C) 6% to 20% by weight of a mixture of at least two organic solvents, and (D) 0% to 10% by weight of at least one sintering aid. 30% to 60% by weight of the solvent mixture (C) consists of at least one 1-hydroxyalkane with 16-20 C-atoms that is non-substituted except for a methyl substitution on the penultimate C-atom.

Abstract: A method for mounting an electronic component on a substrate is provided. The method involves the use of a solder paste that includes a mixture of organic dicarboxylic acids. The thickness of the solder deposit is 25 to 200 ?m.

Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Abstract: A paste may be used to connect at least one electronic component to at least one substrate through contact regions, wherein at least one of the contact regions contains a non-noble metal. The paste contains (a) metal particles, (b) at least one activator that bears at least two carboxylic acid units in the molecule, and (c) a dispersion medium. A method for connecting at least one electronic component to at least one substrate through the contact regions includes steps of providing a substrate having a first contact region and an electronic component having a second contact region; providing the above paste; generating a structure, wherein the first contact region of the substrate contacts the second contact region of the electronic component through the paste; and sintering the structure while producing a module including at least the substrate and the electronic component connected to each other through the sintered paste.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.