Abstract: A power converter includes an apparatus for enclosing a power unit, which is at least partially inside and/or on a heat sink, and for centering a control unit with respect to the power unit. The power unit includes a semiconductor component and a substrate. The apparatus includes a frame designed to at least partially, preferably completely, surround the substrate, two protruding pieces of a first type designed to engage in a recess or an opening in a heat sink, a protruding piece of a second type designed to engage in a recess or an opening in a control unit, and a fixing element, with at least one of the two protruding pieces of a first type and the fixing element being connected to one another and designed to project in opposite directions. The control unit includes an electronic component and is connected to the power module by the fixing element.

Abstract: A power converter includes at least two power semiconductor modules. Each of the power semiconductor modules includes at least one power semiconductor and power contacts, which are electrically conductively connected to the power semiconductors via an external circuit for the parallel connection of the power semiconductor modules. The power semiconductors are further connected to one another in parallel by way of at least one additional connection having a lower parasitic inductance and/or a lower series resistance than the external circuit.

Abstract: In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.

Abstract: A power module includes a power unit. The power unit includes a power semiconductor and a substrate. In order to improve the reliability of the power module, the substrate of the power unit is directly connected in an integrally bonded manner to a surface of a heat sink. The power unit is surrounded at least partially by a housing. The housing includes a housing frame which is connected liquid-tight to the surface of the heat sink and formed from a first dielectric material, and a housing cover which is connected to the housing frame to close the housing and is formed from a second dielectric material.

Abstract: A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

Abstract: A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

Abstract: A heat sink includes a mounting surface for arrangement of a semiconductor element. The mounting surface is formed with an open groove. An electrical line is arranged at least in part in the groove and has a connection region for connection of the semiconductor element.

Abstract: An arrangement for cooling a power module with at least one power unit in a housing is provide, the arrangement having at least one heat sink, in which the arrangement for cooling has at least one heat-sink cover, and at least a part of the power module, in particular the housing, at least a part of the heat sink and/or at least a part of the heat-sink cover are/is configured in such a way that, after attachment of the heat-sink cover, the heat sink is fixed in the housing, in particular by way of clamping, through interaction of the configuration of heat sink, heat-sink cover and/or housing. Also, a power module having such an arrangement for cooling a power module is provided.

Abstract: A method for determining soiling of a heat sink for cooling an electronic component is disclosed. A load curve controlled by the component and a temperature curve along a heat transfer chain from the at least one component to the heat sink are continuously captured. In a training phase, a decision function is determined, which is provided for application to a portion of the load curve and to at least one correspondingly captured portion of a temperature curve. In a classification phase, a non-soiled state of the heat sink is detected when the portion of the load curve presented to the decision function is similar to the portions of the load curve captured in the training phase and when the at least one corresponding portion of a temperature curve is similar to the portions of the temperature curve in question that were correspondingly captured in the training phase.

Abstract: A semiconductor assembly includes a semiconductor module designed for connection to a heat sink and having a surface which faces away from the heat sink and has a depression, a printed circuit board, and an electronic circuit arranged on the printed circuit board. The printed circuit board together with the electronic circuit is secured to the semiconductor module on the surface of the semiconductor module. The electronic circuit includes electronic components configured to protrude into the depression of the semiconductor module.

Abstract: A power module includes at least two power units. Each power unit includes at least one power semiconductor and a substrate. In order to reduce the installation space required for the power module and to improve cooling, the at least one power semiconductor is connected, in particular in a materially bonded manner, to the substrate. The substrates of the at least two power units are each directly connected in a materially bonded manner to a surface of a common heat sink. A power converter having at least one power module is also disclosed.

Abstract: A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

Abstract: A substrate and a first circuit board each have an upper side and a lower side. The substrate lower side is connected to a cooling body. On the upper side of the substrate, first electronic switching elements connect an alternating current potential at a phase terminal to a high direct current potential at a first potential terminal and to a low direct current potential at a second potential terminal. Second electronic switching elements connect the alternating current potential to a middle direct current potential at a third potential terminal. The substrate is spaced from the first circuit board under the first circuit board lower side. The upper side of the substrate faces toward the first circuit board. The second switching elements are at least on the upper side of the first circuit board, possibly additionally also on the lower side of the first circuit board.

Abstract: In a method of manufacturing a power module unit, cooling fins are positioned in recesses of a frame, in particular a metal frame. A first metallic material is applied to the cooling fins and the frame by a thermal spraying process, causing the applied first metallic material to produce a material bond between the cooling fins and the frame.

Abstract: A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

Abstract: A converter unit has a main printed circuit board (MPCB) on which at least one functional module is arranged. By the functional module, at least one AC voltage supplied to the functional module via first power connections of the functional module can be converted into at least two DC voltage potentials output via second power connections. The MPCB has conductor paths via which control signals can be supplied to control connections, and the MPCB has conductor paths which extend from a control unit to first and second control connections of the MPCB and via which the first and second control signals can be supplied to the first and second control connections. The functional module is at least mechanically connected to the MPCB at least in the region of the first and second control connections such that the functional module does not use the first and/or the second control signals.

Abstract: A power module unit, in particular for a frequency converter, includes a base plate having a first side provided with a recess and a second side, a cooling fin fastened in the recess of the base plate at least in one region by a positive fit, a material fit, and/or a non-positive fit, and a substrate provided for a power semiconductor and disposed on the second side of the base plate.

Abstract: A substrate and a first circuit board each have an upper side and a lower side. The substrate lower side is connected to a cooling body. On the upper side of the substrate, first electronic switching elements connect an alternating current potential at a phase terminal to a high direct current potential at a first potential terminal and to a low direct current potential at a second potential terminal. Second electronic switching elements connect the alternating current potential to a middle direct current potential at a third potential terminal. The substrate is spaced from the first circuit board under the first circuit board lower side. The upper side of the substrate faces toward the first circuit board. The second switching elements are at least on the upper side of the first circuit board, possibly additionally also on the lower side of the first circuit board.