Patents by Inventor Jens Urban

Jens Urban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8969203
    Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: March 3, 2015
    Assignee: Sensortechnics GmbH
    Inventors: Leslie M. Landsberger, Oleg Grudin, Jens Urban, Uwe Schwarz
  • Publication number: 20110314435
    Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.
    Type: Application
    Filed: April 21, 2011
    Publication date: December 22, 2011
    Inventors: Leslie M. LANDSBERGER, Oleg GRUDIN, Jens URBAN, Uwe SCHWARZ
  • Patent number: 7951721
    Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: May 31, 2011
    Inventors: Leslie M. Landsberger, Oleg Grudin, Jens Urban, Uwe Schwarz
  • Publication number: 20080309661
    Abstract: A method for the display of process information for a data processing equipment shall enable a particularly simplified and flexible processing, even of complex datasets, based on situation or problem-specific evaluation rules. For this purpose, according to the invention, control data defining the rules for the evaluation of the diagnostic data are fed to an evaluation module, and the evaluation module effects, by means of the rules transmitted by the control data, an evaluation of the diagnostic data by means of which display data suitable for being output on a display device are generated.
    Type: Application
    Filed: September 7, 2007
    Publication date: December 18, 2008
    Applicant: AVAYA GMBH & CO. KG
    Inventor: Jens Urban
  • Publication number: 20080179713
    Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.
    Type: Application
    Filed: November 10, 2005
    Publication date: July 31, 2008
    Inventors: Leslie M. Landsberger, Oleg Grudin, Jens Urban, Uwe Schwarz