Abstract: Various aspects may provide a cleaning assembly having a mounting frame configured to be linked with a connector-holding arrangement. The cleaning assembly may further include a displaceable member configured to support a cleaning element thereon. The displaceable member may be operatively coupled to the mounting frame in a manner so as to be displaceable relative to the mounting frame, along a movement axis, between a first position and a second position of the displaceable member. In the first position of the displaceable member, the displaceable member may be apart from a cleaning-axis of the cleaning assembly. The cleaning-axis may be non-parallel to the movement axis and, with the mounting frame linked with the connector-holding arrangement, the cleaning-axis may be aligned with a connector-alignment-axis of the connector-holding arrangement. In the second position of the displaceable member, the displaceable member may intersect the cleaning-axis.

Abstract: This disclosure describes systems, methods, and devices related to preventing water leakage from jet impingement applied to an integrated circuit under test. An integrated circuit testing apparatus for applying jet impingement to an integrated circuit may include an impingement chamber in contact with an integrated circuit being tested, the impingement chamber comprising water associated with cooling the integrated circuit; and an actuator-driven thermal management block including an air inlet configured to direct a flow of air into an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to the water in the impingement chamber to prevent leakage of the water from the impingement chamber.