Patents by Inventor Jen-Tung Tseng

Jen-Tung Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing method with full edge trimming
    Patent number: 10388535
    Abstract: A wafer processing method uses a chuck table with smaller diameter than a semiconductor wafer to be processed. A cut through edge trimming is therefore implemented on the periphery of the semiconductor wafer to form a cut through straight side at the periphery and also form a flat portion at the periphery as a positioning means for taping and backside grind processes.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: August 20, 2019
    Assignee: POWERTECH TECHNOLOGY INC.
    Inventors: Chui-Liang Chiu, Kun-Chi Hsu, Jen-Tung Tseng, Chin-Ta Wu