Patents by Inventor Jeoffrey Mott

Jeoffrey Mott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding pad metallization for semiconductor devices
    Patent number: 4424527
    Abstract: The invention is directed to a bonding pad metallization for stress sensitive semiconductor devices such as semiconductor lasers or the like. An attendant advantage is a diffusion barrier layer which inhibits the migration of conventional bonding materials such as indium solder.
    Type: Grant
    Filed: July 31, 1981
    Date of Patent: January 3, 1984
    Assignee: Optical Information Systems, Inc.
    Inventors: Srinivas T. Rao, Jeoffrey Mott