Patents by Inventor Jeong A. Lee

Jeong A. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977973
    Abstract: A neuron circuit and an operating method thereof are disclosed. The neuron circuit may include an input unit to which an input pulse is applied, a bipolar memristor configured to have one end connected to one end of the input unit, a first capacitor configured to be connected between the one end of the bipolar memristor and a ground, a first diode configured to have an anode connected to the one end of the bipolar component, a second capacitor configured to have one end connected to a cathode of the first diode, a first switch configured to be connected between the one end of the second capacitor and the ground, and a second switch configured to be connected between the anode of the first diode and the other end of the second capacitor.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: May 7, 2024
    Assignees: Electronics and Telecommunications Research Institute, Konkuk University Industrial Cooperation Corp
    Inventors: Jong Pil Im, Bae Ho Park, Jeong Hun Kim, Seungeon Moon, Chansoo Yoon, Jaewoo Lee, Solyee Im
  • Patent number: 11978858
    Abstract: A non-aqueous electrolyte solution for a lithium secondary battery and a lithium secondary battery including the same are disclosed herein. In some embodiments, a non-aqueous electrolyte solution includes a lithium salt, an organic solvent, and a phosphoric acid-based additive represented by Formula 1 below, which improves the high temperature stability in a lithium secondary battery: wherein R is described herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: May 7, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Haeun Kim, Chul Haeng Lee, Jeongwoo Oh, Jinhyeon Jeong
  • Publication number: 20240147198
    Abstract: A method for sharing data in a transmitting-side electronic device communicating with a receiving-side electronic device is provided. The method includes connecting a voice call with the receiving-side electronic device; obtaining a sharing object to be shared with the receiving-side electronic device; and transmitting data corresponding to the sharing object to the receiving-side electronic device through a data session formed based on information related to the voice call.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-kih HONG, Min-Seok KIM, Ho-Jun LEE, Su-Jeong LIM, Deok-Ho KIM, Cheol-Ju HWANG, Yeul-Tak SUNG
  • Patent number: 11969707
    Abstract: The method for preparing a super absorbent polymer according to the present disclosure has a feature that it is possible to reduce the generation of a fine powder during production of the super absorbent polymer while maintaining excellent physical properties of the super absorbent polymer, including centrifuge retention capacity (CRC) and vortex removal time.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: April 30, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Jaeyul Kim, Jong Hun Song, Gicheul Kim, Yoon Jae Min, Ki Hyun Kim, Seul Ah Lee, In Yong Jeong, Heechang Woo
  • Patent number: 11973553
    Abstract: Proposed is a mobile router for transmitting and receiving millimeter waves to and from a base station, the mobile router including a first member including an antenna array configured to transmit and receive the millimeter waves, a second member, and an angle adjustment part connecting the first member to the second member, wherein the angle adjustment part is formed such that the first member and the second member are adjusted at a predetermined angle so as to allow the antenna array to transmit and receive the millimeter waves at a specific angle. The first member including the antenna array is configured to be unfolded at a predetermined angle with respect to the second member in order to transmit and receive a 5G millimeter wave beam signal at a specific angle, and thus a user can optimally adjust the transmission/reception sensitivity of 5G millimeter waves.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: April 30, 2024
    Assignee: GCT RESEARCH, INC
    Inventors: Jeong Min Kim, Hyungkoo Lee
  • Publication number: 20240132652
    Abstract: The present disclosure relates to a thermoplastic polyurethane composition for injection molding and a method for manufacturing the same. Specifically, the thermoplastic polyurethane composition includes 0.5% by weight to 10.0% by weight of a sulfonate diol, 13% by weight to 60% by weight of an isocyanate, 30% by weight to 70% by weight of an ether-containing polyester polyol, and 5% by weight to 40% by weight of a chain extender.
    Type: Application
    Filed: April 17, 2023
    Publication date: April 25, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DONGSUNG CHEMICAL Co., Ltd., HANWHA ADVANCED MATERIALS CORPORATION
    Inventors: Boo Youn An, In Soo Han, Sang Hyuk Lee, Jae Chan Lee, Hoon Jeong Kim, Gyu Min Lee, Sung Bok Kwak, Dong Ju Lee, Jae Yong Lee
  • Publication number: 20240132639
    Abstract: An olefin-based polymer, a film prepared from the olefin-based polymer, and preparation methods for manufacturing the olefin-based polymer and the film are disclosed. The olefin-based polymer has excellent processability, and a film prepared from the olefin-based polymer, particularly, a linear low density polyethylene film has excellent mechanical strength, in particular, drop impact strength.
    Type: Application
    Filed: December 2, 2021
    Publication date: April 25, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: Jisong JO, Jeong Hynn PARK, Sun Dong KIM, Munhee LEE, Ui Gap JOUNG
  • Patent number: 11964932
    Abstract: Provided are a tricyclodecane dimethanol composition, in which a ratio of structural isomers is controlled, and a preparation method thereof.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: April 23, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Hee Il Chae, Ju-Sik Kang, Jeong Ho Park, Song Lee, Yu Mi Chang
  • Publication number: 20240128407
    Abstract: A display device can include a first substrate having an active area and a non-active area, where the non-active area includes a plurality of first areas spaced apart from each other and a plurality of second areas disposed between the plurality of first areas. The display device can further include a plurality of first pad electrodes disposed on the plurality of first areas, a plurality of side lines disposed on the plurality of first pad electrodes, and a plurality of step compensation layers disposed in the plurality of second areas. By additionally forming the step compensation layers in the second areas, it is possible to compensate for step differences between the plurality of first areas and the plurality of second areas.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 18, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: JeeHun KIM, Hyeran JEONG, Sungeun BAE, Hyo Seob LEE
  • Publication number: 20240126939
    Abstract: There are provided a method for designing a mechanical apparatus and a device using the same. A method for acquiring shape information of a mechanical apparatus based on target performance information according to an embodiment may include: acquiring a first target performance parameter and a second target performance parameter of the mechanical apparatus; acquiring first shape information by using a first model based on the first target performance parameter and the second target performance parameter; acquiring a first prediction performance parameter by using a second model based on the first shape information; and updating the first model based on at least one of the first target performance parameter, the second target performance parameter or the first prediction performance parameter.
    Type: Application
    Filed: April 13, 2023
    Publication date: April 18, 2024
    Inventors: JEONG GYU BAK, SEAWOOK LEE, MUN JIN CHO
  • Publication number: 20240130108
    Abstract: A semiconductor memory device includes a substrate, a bit line on the substrate, word lines provided on the bit line and spaced apart in a first direction parallel to a top surface of the substrate, a back gate electrode provide between a pair of adjacent word lines among the word lines, active patterns provided between the back gate electrode and the pair of adjacent word lines, contact patterns respectively provided on the active patterns, a first back gate insulating pattern provided between the bit line and the back gate electrode, and a second back gate insulating pattern and a third back gate insulating pattern which are provided on the back gate electrode, where the back gate upper insulating pattern includes a material having a first dielectric constant and the back gate lower insulating pattern includes a material having a second dielectric constant that is greater than the first dielectric constant.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Euichul JEONG, Sang-Woon LEE, Sangho LEE, Moonyoung JEONG
  • Publication number: 20240130109
    Abstract: A semiconductor device includes: a semiconductor device, comprising: a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate; a storage node contact plug that is spaced apart from the bit line structure; a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; and a seed liner that is positioned between the conformal spacer and the bit line and thinner than the conformal spacer.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 18, 2024
    Inventors: Beom Ho MUN, Eun Jeong KIM, Jong Kook PARK, Seung Mi LEE, Ji Won CHOI, Kyoung Tak KIM, Yun Hyuck JI
  • Patent number: 11957164
    Abstract: A method for manufacturing a flavor capsule of tobacco according to an embodiment of the present disclosure may comprise: a membrane manufacturing step for manufacturing a membrane of a flavor capsule by a membrane manufacturing part that manufactures a membrane; a capsule manufacturing step for manufacturing the flavor capsule using an apparatus for manufacturing a capsule with the membrane manufactured during the membrane manufacturing step and a flavored liquid to be held in the membrane; and a hardening step for hardening the flavor capsule.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 16, 2024
    Assignee: KT&G CORPORATION
    Inventors: Ick Joong Kim, Ali Jeong Bang, Jung Seop Hwang, Sang Jin Nam, Jae Gon Lee, Han Joo Chung
  • Patent number: 11961030
    Abstract: A method includes receiving trace sensor data associated with a first manufacturing process of a manufacturing chamber. The method further includes processing the trace sensor data by a processing device to generate summary data associated with the trace sensor data. The method further includes generating a quality index score based on the summary data. The method further includes providing an alert to a user based on the quality index score. The alert includes an indication that the manufacturing chamber performance does not meet a first threshold.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sejune Cheon, Jeong Jin Hong, Mikyung Shim, Xiaoqun Zou, Jinkyeong Lee, Sang Hong Kim
  • Patent number: 11957665
    Abstract: The present invention relates to a pharmaceutical composition for preventing or treating alopecia areata acting as a functional antagonist for S1P receptor's subtypes S1PR1 and S1PR4, and more particularly, relates to a pharmaceutical composition containing as an active ingredient a sphingolipid compound acting as a functional antagonist for S1PR1 and S1PR4, does not cause cardiovascular side effects, and is effective in preventing or treating alopecia areata.
    Type: Grant
    Filed: September 26, 2023
    Date of Patent: April 16, 2024
    Assignee: NEXTGEN BIOSCIENCE CO., LTD.
    Inventors: Bong Yong Lee, Yang Hae Park, Eun Jeong Kim
  • Publication number: 20240117168
    Abstract: The present invention relates to a semiconductive resin composition for a high voltage power cable. Specifically, the present invention relates to a semiconductive resin composition comprising a base resin in which ethylene butyl acrylates having different melting indices are mixed, carbon black, an antioxidant, and a crosslinking agent. In addition, the present invention relates to a semiconductive resin composition for a high voltage power cable, the composition having excellent scorch stability and processability and low volume resistance even at a high temperature.
    Type: Application
    Filed: February 17, 2022
    Publication date: April 11, 2024
    Applicant: HANWHA SOLUTIONS CORPORATION
    Inventors: In Jun LEE, Jae Yun LIM, Kisik KIM, Jeong Hyun PARK, Sang Kyu PARK
  • Publication number: 20240119334
    Abstract: A method for linear optical quantum computing includes configuring at least two first Greenberger-Horne-Zeilinger (GHZ) states consisting of three photons; configuring at least one second GHZ state consisting of four or more photons by firstly combining the at least two first GHZ states; generating at least one microcluster; forming a plurality of star clusters consisting of four side qubits around the central qubit; configuring Raussendorf-Harringon-Goyal (RHG) lattice by using the plurality of star clusters; and measuring at least one central qubit of the RHG lattice.
    Type: Application
    Filed: December 5, 2022
    Publication date: April 11, 2024
    Inventors: Hyunseok Jeong, Seok-Hyung Lee, Yong Siah Teo, Srikrishna Omkar
  • Publication number: 20240120616
    Abstract: A secondary battery includes an electrode assembly having a positive electrode provided with a positive electrode tab, a separator, and a negative electrode provided with a negative electrode tab, the positive electrode, the separator, and the negative electrode being wound, the electrode assembly having a core part at a center thereof; a can configured to receive the electrode assembly therein, the negative electrode tab being connected to the can; a cap assembly coupled to an opening of the can, the positive electrode tab being connected to the cap assembly; and a reinforcing member provided on an end of the separator exposed beyond the positive electrode or the negative electrode to prevent heat of the positive electrode tab or the negative electrode tab from being transferred to the separator.
    Type: Application
    Filed: April 19, 2022
    Publication date: April 11, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Soon Kwan KWON, Su Taek JUNG, Seok Hoon JANG, Hyeok JEONG, Sang Ho BAE, Byeong Kyu LEE, Seong Won CHOI, Min Wook KIM, Yong Jun LEE
  • Publication number: 20240116044
    Abstract: An atomic layer deposition method for manufacturing a platinum-based alloy catalyst includes applying a support in a reactor and depositing an alloy of platinum and a non-platinum metal on the support through a super cycle comprising a first sub-cycle and a second sub-cycle.
    Type: Application
    Filed: April 19, 2023
    Publication date: April 11, 2024
    Inventors: Jung Yeon Park, Woong Pyo Hong, Seung Jeong Oh, Se Hun Kwon, Susanta Bera, Hyun Jae Woo, Woo Jae Lee
  • Publication number: 20240120262
    Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE