Patents by Inventor Jeong Bin Jeon

Jeong Bin Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110053479
    Abstract: A method of manufacturing a cutting tool is disclosed. An object of the manufacturing method of a cutting tool is to reduce contamination of an abrasive layer surface, particularly, agglomeration contamination due to slurry by improving hydrophobicity maintaining performance of an abrasive layer. A cutting tool according to the method of manufacturing comprises an abrasive layer on a base member, the abrasive layer having abrasives bonded to a surface thereof; and a coating on the surface of the abrasive layer that is a hydrophobic material film.
    Type: Application
    Filed: May 19, 2008
    Publication date: March 3, 2011
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Shin Kyung Kim, Kee Jung Cheong, Brian Song, Tae Jin Kim, Mun Seak Park, Byung Ju Min, Jeong Bin Jeon